tea1521t-n2 NXP Semiconductors, tea1521t-n2 Datasheet - Page 13

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tea1521t-n2

Manufacturer Part Number
tea1521t-n2
Description
Tea152x Family Smps Ics For Low-power Systems
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
14. Package outline
Fig 7. Package outline SOT97-1 (DIP8)
TEA152X_FAM_2
Product data sheet
DIP8: plastic dual in-line package; 8 leads (300 mil)
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT97-1
max.
0.17
4.2
A
min.
0.02
0.51
A
1
L
050G01
max.
0.13
A
3.2
IEC
Z
2
8
1
pin 1 index
0.068
0.045
1.73
1.14
b
b
D
e
0.021
0.015
0.53
0.38
b
1
MO-001
JEDEC
0.042
0.035
1.07
0.89
5
4
b
b
REFERENCES
1
2
0
Rev. 02 — 25 January 2006
A
b
0.014
0.009
1
2
0.36
0.23
w
c
A
E
M
2
SC-504-8
scale
JEITA
D
0.39
0.36
A
9.8
9.2
5
(1)
6.48
6.20
0.26
0.24
E
(1)
10 mm
2.54
0.1
e
7.62
0.3
e
c
1
SMPS ICs for low-power systems
TEA152x family
3.60
3.05
0.14
0.12
(e )
M
L
M
PROJECTION
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
EUROPEAN
1
H
E
8.25
7.80
0.32
0.31
M
E
10.0
0.39
0.33
M
8.3
H
ISSUE DATE
0.254
0.01
99-12-27
03-02-13
w
SOT97-1
0.045
max.
1.15
Z
(1)
13 of 20

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