tea1520p NXP Semiconductors, tea1520p Datasheet
tea1520p
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tea1520p Summary of contents
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TEA152x SMPS ICs for low-power systems Rev. 03 — 23 March 2009 1. General description The TEA152x family STARplug is a Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains implemented in ...
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... NXP Semiconductors 3. Applications I Chargers I Adapters I Set Top Box (STB) I DVD I CD(R) I TV/monitor standby supplies I PC peripherals I Microcontroller supplies in home applications and small portable equipment, etc. 4. Quick reference data Table 1. Symbol V drain R DSon osc I drain T amb TEA152X_3 Product data sheet Quick reference data ...
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... NXP Semiconductors 5. Ordering information Table 2. Ordering information Type number Package Name Description TEA1520P DIP8 plastic dual in-line package; 8 leads (300 mil) TEA1521P DIP8 plastic dual in-line package; 8 leads (300 mil) TEA1522P DIP8 plastic dual in-line package; 8 leads (300 mil) TEA1523P DIP8 plastic dual in-line package ...
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... NXP Semiconductors 7. Pinning information 7.1 Pinning Fig 2. 7.2 Pin description Table 3. Symbol V CC GND GND GND GND RC REG AUX GND GND SOURCE n.c. n.c. DRAIN TEA152X_3 Product data sheet DRAIN CC GND 2 7 n.c. TEA152xP SOURCE 4 5 REG AUX 001aae137 Pin configuration DIP8 Pin description ...
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... NXP Semiconductors 8. Functional description The TEA152x family is the heart of a compact flyback converter, with the IC placed at the primary side. The auxiliary winding of the transformer can be used for indirect feedback to control the isolated output. This additional winding also powers the IC. A more accurate control of the output voltage and/or current can be implemented with an additional secondary sensing circuit and opto coupler feedback ...
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... NXP Semiconductors 8.4 Valley switching A new cycle is started when the primary switch is switched on (see certain time (determined by the oscillator voltage RC and the internal regulation level), the switch is turned off and the secondary stroke starts. The internal regulation level is determined by the voltage on pin REG. ...
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... NXP Semiconductors Figure 5 the output voltage V the factor N (determined by the turns ratio of the transformer). system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on losses to a minimum. At 200 kHz, the next primary stroke is started at 33 before the valley. The switch-on losses are still reduced significantly. ...
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... NXP Semiconductors 8.9 OverTemperature Protection (OTP) An accurate temperature protection is provided in the device. When the junction temperature exceeds the thermal shut-down temperature, the IC stops switching. During thermal protection, the IC current is lowered to the start-up current. The IC continues normal operation as soon as the over temperature situation has disappeared. ...
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... NXP Semiconductors 9. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground; positive currents flow into the device; pins V current driven and pins REG and AUX are not allowed to be voltage driven. ...
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... NXP Semiconductors 10. Thermal characteristics Table 5. Symbol R th(j-a) [1] Thermal resistance R printed-circuit board. See the TEA152x application notes for details. 11. Characteristics Table over temperature; all voltages are measured with respect to ground; currents are amb positive when flowing into the IC; unless otherwise specified. ...
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... NXP Semiconductors Table over temperature; all voltages are measured with respect to ground; currents are amb positive when flowing into the IC; unless otherwise specified. Symbol Valley switching ( V/ t) vrec f valley t d(vrec-swon) Current and short-circuit winding protection V source(max) t d(prop) V swp ...
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... NXP Semiconductors 12. Application information mains R1 Fig 6. Primary sensed application; configuration for TEA152xP Further application information can be found in the TEA152x application notes. 13. Test information 13.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. ...
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... NXP Semiconductors 14. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... Release date TEA152X_3 20090323 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • The minimum value of T • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Functional description . . . . . . . . . . . . . . . . . . . 5 8.1 Start-up and undervoltage lockout . . . . . . . . . . 5 8.2 Oscillator 8.3 Duty factor control 8.4 Valley switching 8.5 Demagnetization 8.6 Minimum and maximum duty factor . . . . . . . . . 7 8 ...