isd5100 Winbond Electronics Corp America, isd5100 Datasheet - Page 54

• Manufacturer Part Number: isd5100
• Description: Single-chip 1 To 16 Minutes Duration Voice Record/playback Devices With Digital Storage Capability
• Manufacturer: Winbond Electronics Corp America

V
To minimize noise, the analog and digital circuits in the ISD5100 Series devices use separate power
busses. These +3 V busses lead to separate pins. Tie the V
decouple both supplies as near to the package as possible.
V
The ISD5100 Series utilizes separate analog and digital ground busses. The analog ground (V
pins should be tied together as close to the package as possible and connected through a low-
impedance path to power supply ground. The digital ground (V
separate low impedance path to power supply ground. These ground paths should be large enough to
ensure that the impedance between the V
the die is connected to V
attach area must be connected to V
NC (Not Connect)
These pins should not be connected to the board at any time. Connection of these pins to any signal,
ground or V
CCA
SSA
, V
, V
SSD
CCD
7.6.3. Power and Ground Pins
(Ground Inputs)
(Voltage Inputs)
CC,
may result in incorrect device behavior or cause damage to the device.
SSD
through the substrate resistance. In a chip-on-board design, the die
SSD
.
SSA
pins and the V
- 54 -
CCD
SSD
SSD
pins together as close as possible and
pin is less than 3Ω. The backside of
) pin should be connected through a
ISD5100 SERIES
SSA
)