isd5100 Winbond Electronics Corp America, isd5100 Datasheet - Page 81

• Manufacturer Part Number: isd5100
• Description: Single-chip 1 To 16 Minutes Duration Voice Record/playback Devices With Digital Storage Capability
• Manufacturer: Winbond Electronics Corp America

Notes
1.
2.
3.
ISD5108 Device
Die Dimensions (include scribe line)
Die Thickness
Pad Opening
12.6 ISD5108 D
Single pad: 90 x 90 痠
Double pad: 180 x 90 痠
X: 4230 痠
Y: 6090 痠
292.1 痠 ? 12.7 痠
The backside of die is internally connected to Vss. It MUST NOT be connected to any other potential or
damage may occur.
Double bond recommended, if treated as single doubled-pad.
This figure reflects the current die thickness. Please contact Winbond as this thickness may change in
the future.
[3]
IE
I
V
NFORMATION
SSA
MIC +
MIC -
V
ANA OUT +
SSD
≈
V
SSD
ANA OUT -
A0
SDA
- 81 -
A1
ACAP
SCL
ISD5108
V
SP -
CCD
V
V
CCD
SSA
XCLK
[2]
Publication Release Date: May 16, 2007
SP +
INT
ISD5100 SERIES
V
CCA
RAC
[2]
≈
V
SSA
ANA IN
AUX IN
Revision 1.4
AUX OUT