cbt3253ads NXP Semiconductors, cbt3253ads Datasheet
cbt3253ads
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cbt3253ads Summary of contents
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... Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA 3. Ordering information Table +85 C amb Type number Topside CBT3253AD CBT3253ADB C3253A CBT3253ADS CT3253A CBT3253APW CT3253A [1] Also known as QSOP16. switch connection between two ports Ordering information Package mark Name CBT3253AD ...
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... NXP Semiconductors 4. Functional diagram S0 S1 1OE 2OE Fig 1. Logic diagram of CBT3253A (positive logic) CBT3253A_2 Product data sheet CBT3253A Rev. 02 — 8 February 2007 CBT3253A Dual 1-of-4 FET multiplexer/demultiplexer © NXP B.V. 2007. All rights reserved. 6 1B1 5 1B2 4 1B3 3 1B4 10 2B1 ...
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... GND 2A 002aab824 2OE 2B4 CBT3253ADS 5 12 2B3 6 11 2B2 2B1 002aab826 (QSOP16) Pin description Pin Description 1 output enable (active LOW) 2 select-control input outputs 7 A input 8 ...
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... NXP Semiconductors 6. Functional description Refer to 6.1 Function selection Table HIGH state LOW state Don’t Care Inputs 1OE Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol CCC stg [1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed ...
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... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics +85 C amb Symbol Parameter V input clamping voltage IK V pass voltage pass I input leakage current LI I quiescent supply current CC I additional quiescent supply CC current (control inputs) C input capacitance i (control pins) C off-state input/output io(off) ...
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... NXP Semiconductors 10.1 AC waveforms V = GND to 3 and t PLZ t and t PZL t and t PLH Fig 6. Input to output propagation delay (1) Waveform 1 is for an output with internal conditions such that the output is LOW except when (2) Waveform 2 is for an output with internal conditions such that the output is HIGH except when Fig 7 ...
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... NXP Semiconductors 11. Test information Fig 8. Test circuit Table 8. Test PLZ PZL PHZ PZH CBT3253A_2 Product data sheet from output under test Test data are given in Table 8. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz ...
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... NXP Semiconductors 12. Package outline SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT338-1 Fig 10 ...
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... NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.25 1.55 mm 1.73 0.25 0.10 1.40 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT519-1 Fig 11 ...
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... NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 13. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Abbreviations Table 11. Acronym CDM ESD FET HBM MM PRR RC TTL CBT3253A_2 Product data sheet maximum peak temperature ...
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... Release date CBT3253A_2 20070208 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 5 “Operating – changed (V – changed (V • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Function selection Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 10.1 AC waveforms Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline ...