cbt3306d NXP Semiconductors, cbt3306d Datasheet
cbt3306d
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cbt3306d Summary of contents
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... Quick reference data Table GND = 0 V amb Symbol io(off Ordering information Table 2: Type number CBT3306D CBT3306PW switch connection between two ports Quick reference data Parameter Conditions propagation delay from input (nA or nB) to output ( ...
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... V CC CBT3306_2 Product data sheet 1OE 2OE 1 8 1OE 2OE CBT3306D GND 2A 002aab983 Pin description Pin Description 1 output enable port input port output 1 4 ground ( port input port output 2 ...
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Philips Semiconductors 7. Functional description Refer to 7.1 Function selection Table 4: Input Limiting values Table 5: In accordance with the Absolute Maximum Rating System (IEC 60134 +85 C, unless otherwise ...
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Philips Semiconductors 10. Static characteristics Table 7: Static characteristics +85 C, unless otherwise specified. amb Symbol Parameter V input clamping voltage IK I input leakage current LI I quiescent supply current CC V pass voltage ...
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Philips Semiconductors 11.1 AC waveforms V = GND to 3 and t PLZ t and t PZL t and t PLH Fig 4. Input to output propagation delay (1) Waveform 1 is for an output with internal ...
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Philips Semiconductors 12. Test information Fig 6. Test circuit Table 9: Test PLZ PZL PHZ PZH CBT3306_2 Product data sheet from output under test Test data are given in Table 9. All ...
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Philips Semiconductors 13. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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Philips Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 ...
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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 17. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...