w25q32bw Winbond Electronics Corp America, w25q32bw Datasheet - Page 64

• Manufacturer Part Number: w25q32bw
• Description: 32m-bit 1.8v Serial Flash Memory With Dual And Quad Spi
• Manufacturer: Winbond Electronics Corp America

12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
SYMBOL
E1
D
CP
A1
A2
e
A
C
E
b
L

(2)
(3)
(3)
1.47
0.10
0.33
0.19
4.80
5.80
3.80
0.40
MIN
---
---
0
o
MILLIMETERS
1.27 BSC
TYP.
1.60
1.45
0.41
0.20
4.85
6.00
3.90
0.71
---
---
---
MAX
1.72
0.24
0.50
0.25
4.95
6.19
4.00
1.27
0.10
---
8
o
- 64 -
0.0075
0.058
0.004
0.013
0.189
0.228
0.150
0.015
MIN
---
---
0
o
0.050 BSC
INCHES
0.063
0.057
0.016
0.008
0.191
0.236
0.154
0.028
TYP.
---
---
---
0.0098
0.009
0.004
0.068
0.020
0.195
0.244
0.157
0.050
MAX
---
8
o
W25Q32BW