tza3043 NXP Semiconductors, tza3043 Datasheet - Page 8

• Manufacturer Part Number: tza3043
• Description: Gigabit Ethernet/fibre Channel Transimpedance Amplifier
• Manufacturer: NXP Semiconductors

Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
HANDLING
Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during
assembly and handling of the bare die. Additional safety can be obtained by bonding the V
remaining pads may then be bonded to their external connections in any order.
THERMAL CHARACTERISTICS
2000 Mar 28
V
V
I
P
T
T
T
R
n
SYMBOL
SYMBOL
stg
j
amb
CC
n
tot
th(j-a)
Gigabit Ethernet/Fibre Channel
transimpedance amplifier
supply voltage
DC voltage
DC current
total power dissipation
storage temperature
junction temperature
ambient temperature
thermal resistance from junction to ambient
pin/pad IPhoto
pins/pads OUT and OUTQ
pad AGC (bare die only)
pin/pad DREF
pin/pad IPhoto
pins/pads OUT and OUTQ
pad AGC (bare die only)
pin/pad DREF
PARAMETER
PARAMETER
8
TZA3043; TZA3043B
0.5
0.5
0.5
0.5
0.5
2.5
15
0.2
2.5
65
40
MIN.
VALUE
160
CC
and GND pads first, the
+6
+1
V
V
V
+2.5
+15
+0.2
+2.5
300
+150
150
+85
CC
CC
CC
MAX.
Product specification
+ 0.5
+ 0.5
+ 0.5
UNIT
V
V
V
V
V
mA
mA
mA
mA
mW
K/W
C
C
C
UNIT