tza3033 NXP Semiconductors, tza3033 Datasheet
tza3033
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tza3033 Summary of contents
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... DATA SHEET TZA3033 SDH/SONET STM1/OC3 transimpedance amplifier Objective specification File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 1998 Jul 08 ...
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... BLOCK DIAGRAM handbook, full pagewidth 1 nF DREF IPhoto (1) AGC analog I/O is only available on the TZA3033U (pad 15). The numbers in brackets refer to the pad numbers of the naked die version. 1998 Jul 08 APPLICATIONS Digital fibre optic receiver in short, medium and long haul optical telecommunications transmission systems or in high speed data networks Wideband RF gain block ...
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... PIN diode should be connected to this pin; DC bias voltage is 1048 mV ground ground data output; OUT goes HIGH when current flows into IPhoto (pin 3) compliment of OUT (pin 6) supply voltage OUTQ OUT 6 5 GND 3 Objective specification TZA3033 DESCRIPTION ); cathode should be connected to this pin ...
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... Bonding pad locations handbook, full pagewidth DREF GND 2 IPhoto 3 GND Pad 15 (AGC) is not bonded. 1998 Jul TESTA TZA3033U TESTB Fig.3 Bonding diagram TZA3033U. 4 Objective specification TZA3033 OUTQ 6 OUT GND MGR371 ...
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... AGC. 1055 The AGC voltage can be monitored at pad 15 on the naked 1055 die (TZA3033U). Pad 15 is not bonded in the packaged device (TZA3033T). This pad can be left unconnected 1055 during normal operation. It can also be used to force an external AGC voltage ...
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... V O(max) V OQH V OQL V O(min) Fig.5 Logic level symbol definitions for data outputs OUT and OUTQ. 1998 Jul 08 800 800 2 mA 4.5 mA Fig.4 Data output circuit Objective specification TZA3033 30 OUTQ 30 OUT 4.5 mA MGR290 o(p-p) MGR243 ...
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... SYMBOL V supply voltage voltage n pin 3/pad 5: IPhoto pins 6 and 7/pads 11 and 12: OUT and OUTQ pad 15: AGC (TZA3033U only) pin 1/pad 1: DREF I DC current n pin 3/pad 5: IPhoto pins 6 and 7/pads 11 and 12: OUT and OUTQ pad 15: AGC (TZA3033U only) pin 1/pad 1: DREF ...
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... coupled 100 single-ended; DC tested 42 20% to 80% 80 pF. This was comprised of 0.5 pF for the MHz will typically add an extra the photodiode CC 8 Objective specification TZA3033 TYP. MAX. 16 tbf tbf 1 0 +1800 +1 +1600 1048 1.800 V 1.700 V 1.600 V ...
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... SDH/SONET STM1/OC3 transimpedance amplifier APPLICATION INFORMATION handbook, full pagewidth 22 nF DREF 1 IPhoto GND 1998 Jul 680 OUTQ 7 TZA3033T OUT GND GND Fig.6 Application diagram. 9 Objective specification TZA3033 100 nF 100 MGR370 ...
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... 2.5 scale (1) ( 0.25 5.0 4.0 6.2 1.27 0.19 4.8 3.8 5.8 0.0100 0.20 0.16 0.244 0.050 0.0075 0.19 0.15 0.228 REFERENCES JEDEC EIAJ MS-012AA 10 Objective specification TZA3033 detail 1.0 0.7 1.05 0.25 0.25 0.1 0.4 0.6 0.039 0.028 0.041 0.01 0.01 0.004 0.016 0.024 EUROPEAN ...
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... Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds 300 C. When using a dedicated tool, all other leads can be soldered in one operation within seconds between 270 and 320 C. 11 Objective specification TZA3033 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Jul 08 12 Objective specification TZA3033 ...
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... Philips Semiconductors SDH/SONET STM1/OC3 transimpedance amplifier 1998 Jul 08 NOTES 13 Objective specification TZA3033 ...
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... Philips Semiconductors SDH/SONET STM1/OC3 transimpedance amplifier 1998 Jul 08 NOTES 14 Objective specification TZA3033 ...
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... Philips Semiconductors SDH/SONET STM1/OC3 transimpedance amplifier 1998 Jul 08 NOTES 15 Objective specification TZA3033 ...
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Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, ...