buk221 NXP Semiconductors, buk221 Datasheet - Page 13

• Manufacturer Part Number: buk221
• Description: Buk221-50dy Dual Channel High-side Topfet Tm
• Manufacturer: NXP Semiconductors

Philips Semiconductors
9. Package outline
9397 750 11167
Product data
Fig 15. SOT427 (D
Epoxy meets UL94 V0 at 1/8’’. Net mass: 1.5g. For soldering guidelines and surface mount footprint design, please refer to
Data Handbook SC18.
Plastic single-ended surface mounted package (Philips version of D
7 leads (one lead cropped)
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT427
4.50
4.10
A
2
H D
-PAK).
1.40
1.27
A 1
D
D 1
0.85
0.60
b
IEC
1
0.64
0.46
c
e
e
max.
11
D
e
JEDEC
E
4
1.60
1.20
e
D 1
REFERENCES
e
Rev. 01 — 16 April 2003
10.30
9.70
E
e
0
7
1.27
e
b
scale
EIAJ
2.5
2.90
2.10
L p
5 mm
15.80
14.80
H D
mounting
2.60
2.20
2
Q
-PAK);
base
L p
A 1
Dual channel high-side TOPFET™
Q
PROJECTION
c
EUROPEAN
A
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
BUK221-50DY
ISSUE DATE
99-06-25
01-04-18
SOT427
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