lm75adp NXP Semiconductors, lm75adp Datasheet
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LM75A Digital temperature sensor and thermal watchdog Rev. 04 — 10 July 2007 1. General description The LM75A is a temperature-to-digital converter using an on-chip band gap temperature sensor and Sigma-delta A-to-D conversion technique. The device is also a thermal ...
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... I Industrial controllers 4. Ordering information Table 1. Type number LM75AD LM75ADP 4.1 Ordering options Table 2. Type number LM75AD LM75ADP LM75A_4 Product data sheet Digital temperature sensor and thermal watchdog 2 C from +100 from +125 C Ordering information Package Name Description SO8 plastic small outline package; 8 leads; ...
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... POINTER CONFIGURATION REGISTER REGISTER TEMPERATURE COUNTER REGISTER TOS TIMER REGISTER COMPARATOR/ THYST INTERRUPT REGISTER GND SDA 1 SCL 2 LM75ADP OS 3 GND 4 002aad028 Fig 3. Pin configuration for TSSOP8 C-bus serial bidirectional data line; open-drain. 2 C-bus serial clock input. LM75A OS 002aad029 ...
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... NXP Semiconductors Table 3. Symbol Functional description 7.1 General operation The LM75A uses the on-chip band gap sensor to measure the device temperature with the resolution of 0.125 C and stores the 11-bit 2's complement digital data, resulted from 11-bit A-to-D conversion, into the device Temp register. This Temp register can be read at any time by a controller on the I conversion in progress during the read operation ...
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... NXP Semiconductors In both cases, comparator mode and interrupt mode, the OS output is activated only if a number of consecutive faults, defined by the device fault queue, has been met. The fault queue is programmable and stored in the two bits, B3 and B4, of the Configuration register. Also, the OS output active state is selectable as HIGH or LOW by setting accordingly the confi ...
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... NXP Semiconductors 8 devices can be connected to the same bus without address conflict. Because the input pins, SCL, SDA and A2 to A0, are not internally biased important that they should not be left floating in any application. Table HIGH LOW. MSB 1 7.4 Register list ...
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... NXP Semiconductors read a register that is different from the one that has been recently read, the pointer byte must be included. However, a write to the LM75A must always include the pointer byte in the statement. The bus communication protocols are described in At power-up, the Pointer value is equal to 0 and the Temp register is selected; users can then read the Temp data without specifying the pointer byte. 7.4.2 Confi ...
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... NXP Semiconductors When reading register Temp, all 16 bits of the two data bytes (MSByte and LSByte) are provided to the bus and must be all collected by the controller to complete the bus operation. However, only the 11 most significant bits should be used, and the 5 least signifi ...
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... NXP Semiconductors Table 11. MSByte Table 12. MSByte When a set-point register is read, all 16 bits are provided to the bus and must be collected by the controller to complete the bus operation. However, only the 9 most significant bits should be used and the 7 LSB of the LSByte are equal to zero and should be ignored. ...
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... NXP Semiconductors The main difference between the two modes is that in OS comparator mode, the OS output becomes active when Temp has exceeded T below T the state of the OS output; while in OS interrupt mode, once it has been activated either by exceeding T reading a register, then the OS output is reset. ...
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... NXP Semiconductors When the power supply voltage is dropped below the device power-on reset level of approximately 1.9 V (POR) and then rises up again, the device will be reset to its default condition as listed above. 7.10 Protocols for writing and reading the registers The communication between the host and the LM75A must strictly follow the rules as defi ...
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... NXP Semiconductors SCL SDA device address START acknowledge Fig 5. Write configuration register (1-byte data SCL SDA device address START 1 2 SCL (cont.) SDA (cont device address Fig 6. Read configuration register including pointer byte (1-byte data) ...
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... NXP Semiconductors 1 SCL SDA S 1 START 1 SCL (cont.) SDA (cont.) D7 Fig 8. Write Tos or Thyst register (2-byte data SCL SDA device address START SCL (cont) SDA (cont device address Fig 9 ...
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... NXP Semiconductors 8. Application design-in information Fig 11. Typical application 9. Limiting values Table 15. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol O(sink esd T stg T j 10. Recommended operating conditions Table 16. Symbol amb LM75A_4 Product data sheet Digital temperature sensor and thermal watchdog ...
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... NXP Semiconductors 11. Static characteristics Table 17. Static characteristics +125 C; unless otherwise specified. CC amb Symbol Parameter T temperature accuracy ACC T temperature resolution res T temperature conversion CONV(T) time I supply current DD V HIGH-level input voltage IH V LOW-level input voltage IL V input voltage hysteresis ...
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... NXP Semiconductors 12. Dynamic characteristics 2 Table 18. I C-bus interface dynamic characteristics +125 C; unless otherwise specified. CC amb Symbol Parameter T SCL clock period CLK t HIGH period of the SCL clock HIGH t LOW period of the SCL clock LOW t hold time (repeated) START condition HD ...
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... NXP Semiconductors 13. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 14. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 15. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 15. Abbreviations Table 21. Acronym A-to-D CDM ESD HBM 2 I C-bus I/O LSB LSByte MM MSB MSByte POR LM75A_4 ...
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... Release date LM75A_4 20070710 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • added (new) • added separate pin configuration drawings for SO8 and TSSOP8 • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 7.1 General operation . . . . . . . . . . . . . . . . . . . . . . . 4 2 7.2 I C-bus serial interface . . . . . . . . . . . . . . . . . . . 5 7.3 Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.4 Register list . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.4.1 Pointer register . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.4.2 Configuration register . . . . . . . . . . . . . . . . . . . . 7 7 ...