pip250m NXP Semiconductors, pip250m Datasheet - Page 13

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pip250m

Manufacturer Part Number
pip250m
Description
Pip250m Integrated Buck Converter
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
13. Package outline
Fig 12. SOT687-1.
9397 750 10904
Product data
HVQFN68: plastic thermal enhanced very thin quad flat package; no leads;
68 terminals; body 10 x 10 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE
VERSION
SOT687-1
max.
A
1
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
L
E h1
E h1
17
1
0.80
0.65
A 4
18
68
0.30
0.18
- - -
IEC
b
0.2
D h
c
e
10.15
9.85
D
D 1
e 1
D
MO-220
JEDEC
9.95
9.55
D 1
D h
REFERENCES
Rev. 02 — 21 February 2003
D h
3.8
3.5
b
10.15
9.85
E
52
34
JEITA
9.95
9.55
- - -
35
51
E 1
E 1
B
w
v
0
e
M
M
A
E
7.85
7.55
E h
E h
C
C
e 2
A
scale
E h1
3.8
3.5
2.5
B
0.5
e
5 mm
A
e 1
8
y 1 C
A 4
e 2
8
A 1
PROJECTION
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
EUROPEAN
0.75
0.50
Integrated buck converter
L
detail X
0.1
X
v
C
y
PIP250M
0.05
w
ISSUE DATE
02-04-24
02-10-18
0.05
y
SOT687-1
c
0.1
y 1
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