tza1020 NXP Semiconductors, tza1020 Datasheet - Page 34
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tza1020
Manufacturer Part Number
tza1020
Description
Pre-amplifiers For Cd-rw Systems
Manufacturer
NXP Semiconductors
Datasheet
1.TZA1020.pdf
(36 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
tza1020HP/M1
Manufacturer:
LSI
Quantity:
23 164
Part Number:
tza1020HP/M1
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
tza1020HP/M1A
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
14.5
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2000 Oct 30
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Pre-amplifiers for CD-RW systems
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
Suitability of surface mount IC packages for wave and reflow soldering methods
, SO, SOJ
PACKAGE
not suitable
suitable
not recommended
not recommended
(2)
WAVE
34
(3)(4)
(5)
SOLDERING METHOD
suitable
suitable
suitable
suitable
suitable
TZA1020; TZA1020A
REFLOW
Product specification
(1)