s71pl127j04bfwtz3 Meet Spansion Inc., s71pl127j04bfwtz3 Datasheet - Page 17

• Manufacturer Part Number: s71pl127j04bfwtz3
• Description: Stacked Multi-chip Product Mcp Flash Memory And Ram With 32 Megabit 2m X 16-bit Cmos 3.0 Volt-only Simultaneous Operation Page Mode Flash Memory And 16/8/4 Megabit 1m/512k/256k X 16-bit Pseudo Static Ram Or 8/4 Megabit Cmos Static Ram
• Manufacturer: Meet Spansion Inc.

July 17, 2007 S71PL-J_00_B5
TLA064—64-ball Fine-Pitch Ball Grid Array (FBGA) 8 x 11.6mm Package
PACKAGE
SYMBOL
SD / SE
JEDEC
A
D x E
MD
ME
A1
A2
D1
E1
eE
eD
φb
A
D
E
n
CORNER
0.15
(2X)
PIN A1
A2
A1
C
C1,C2,C9,C10,D1,D10,E1,E10,
H1,H10,J1,J10,K1,K2,K9,K10
F1,F5,F6,F10,G1,G5,G6,G10
M2,M3,M4,M5,M6,M7,M8,M9
0.17
0.81
0.35
B1,B2,B3,B4,B7,B8,B9,B10
MIN
A2,A3,A4,A5,A6,A7,A8,A9
L1,L2,L3,L4,L7,L8,L9,L10
---
64X
11.60 mm x 8.00 mm
INDEX MARK
0.15
0.08
11.60 BSC.
PACKAGE
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
TLA 064
10
6
NOM
0.40
N/A
b
---
---
---
12
10
64
M C A B
M C
D a t a
MAX
1.20
0.97
0.45
---
SIDE VIEW
TOP VIEW
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S71PL-J Based MCPs
S h e e t
NOTE
C
0.15
A
(2X)
E
B
C
eE
0.20
0.08
10
C
C
eD
9
8
7
6
5
4
3
2
1
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M
L
K
SD
J
7
BOTTOM VIEW
H
G
D1
F
E
D C
B
A
SE
CORNER
PIN A1
3352 \ 16-038.22a
7
E1
17