s71pl127j04bfwtz3 Meet Spansion Inc., s71pl127j04bfwtz3 Datasheet - Page 19

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s71pl127j04bfwtz3

Manufacturer Part Number
s71pl127j04bfwtz3
Description
Stacked Multi-chip Product Mcp Flash Memory And Ram With 32 Megabit 2m X 16-bit Cmos 3.0 Volt-only Simultaneous Operation Page Mode Flash Memory And 16/8/4 Megabit 1m/512k/256k X 16-bit Pseudo Static Ram Or 8/4 Megabit Cmos Static Ram
Manufacturer
Meet Spansion Inc.
Datasheet
July 17, 2007 S71PL-J_00_B5
FTA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 8 x 11.6mm Package
PACKAGE
SYMBOL
SD / SE
JEDEC
A
D x E
MD
ME
D1
eD
A1
A2
E1
φb
eE
A
D
E
n
CORNER
0.15
(2X)
PIN A1
A2
A1
C
B1,B10,C1,C10,D1,D10,E1,E10
M2,M3,M4,M5,M6,M7,M8,M9
84X
MIN
0.17
1.02
0.35
---
A2,A3,A4,A5,A6,A7,A8,A9
F1,F10,G1,G10,H1,H10
J1,J10,K1,K10,L1,L10
11.60 mm x 8.00 mm
0.15 M C
0.08
INDEX MARK
6
11.60 BSC.
PACKAGE
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
b
FTA 084
M C
NOM
0.40
N/A
10
---
---
---
12
10
84
A B
D a t a
SIDE VIEW
TOP VIEW
MAX
1.40
1.17
0.45
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S71PL-J Based MCPs
S h e e t
NOTE
C
A
0.15
(2X)
E
B
C
0.20 C
0.08
eE
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
eD
10
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M L
K
SD
7
J
BOTTOM VIEW
H
G
D1
F
E
D C
B
A
SE
CORNER
PIN A1
3388 \ 16-038.21a
7
E1
19

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