m36p0r9060e0 STMicroelectronics, m36p0r9060e0 Datasheet - Page 19

• Manufacturer Part Number: m36p0r9060e0
• Description: 512 Mbit X16, Multiple Bank, Multi-level, Burst Flash Memory 64 Mbit Burst Psram, 1.8v Supply, Multi-chip Package
• Manufacturer: STMicroelectronics

M36P0R9060E0
6
Package mechanical
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 6.
1. Drawing is not to scale.
TFBGA 107 8x11mm - 9x12 active ball array, 0.8mm pitch, package outline
E
E1
BALL "B1"
FD
A
e
D1
D
b
A1
FE
e
SE
A2
6 Package mechanical
BGA-Z85
ddd
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