oq2541bhp NXP Semiconductors, oq2541bhp Datasheet - Page 30

• Manufacturer Part Number: oq2541bhp
• Description: Oq2541bhp; Oq2541bu Sdh/sonet Data And Clock Recovery Unit Stm1/4/16 Oc3/12/48 Ge
• Manufacturer: NXP Semiconductors

Philips Semiconductors
BONDING PAD LOCATIONS
Table 6 Bonding pad locations.
2000 Sep 18
ENL
GND
CLOOP
CLOOPQ
GND
DLOOP
DLOOPQ
GND
DREF19
BYPASS
GND
LOCK
i.c.
GND
CAPUPQ
CAPDOQ
GND
i.c.
i.c.
GND
CREF
CREFQ
GND
ALLON
V
GND
DOUT1250
DOUT622
GND
DOUT155
V
GND
DIN
DINQ
GND
i.c.
PC
SYMBOL
EE1
EE2
SDH/SONET data and clock recovery unit
STM1/4/16 OC3/12/48 GE
PAD
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
1
2
3
4
5
6
7
8
9
+77.5
+232.5
+387.5
+542.5
+697.5
+852.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+852.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
852.5
697.5
542.5
387.5
232.5
77.5
COORDINATES
x
+852.5
+697.5
+542.5
+387.5
+232.5
+77.5
+77.5
+232.5
+387.5
+542.5
+697.5
+852.5
+1017.5
77.5
232.5
387.5
542.5
697.5
852.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
1017.5
852.5
697.5
542.5
387.5
232.5
77.5
y
(1)
30
Note
1. All x and y coordinates represent the position of the
GND
LOS
i.c.
GND
DOUT
DOUTQ
GND
COUT
COUTQ
GND
AREF
SYMBOL
centre of the pad in m with respect to the centre of the
die (see Fig.33).
OQ2541BHP; OQ2541BU
PAD
38
39
40
41
42
43
44
45
46
47
48
+697.5
+542.5
+387.5
+232.5
+77.5
77.5
232.5
387.5
542.5
697.5
852.5
COORDINATES
x
Product specification
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
+1017.5
y
(1)