s71ns128nc0 Meet Spansion Inc., s71ns128nc0 Datasheet - Page 10

• Manufacturer Part Number: s71ns128nc0
• Description: Stacked Multi-chip Product Mcp Mirrorbit Flash Memory And Psram 256mb 16m X 16-bit / 128mb 8m X 16-bit / 64mb 4m X 16-bit 110 Nm Cmos 1.8 Volt-only, Multiplexed, Simultaneous Read/write, Burst Mode Flash Memory With 8 Mb 512k X 16-bit
• Manufacturer: Meet Spansion Inc.

4.3
10
4.3.1
Physical Dimensions
NLB056—9.2 x 8.0 mm, 56-ball VFBGA
PACKAGE
SYMBOL
SD / SE
JEDEC
D x E
MD
ME
A A2
A1
A2
D1
E1
Øb
eE
eD
A
D
E
n
CORNER
0.10 C
(2X)
PIN A1
G1,G2,G13,G14,H1,H2,H5,H6,H9,H10,H13,H14
D1,D2,D13,D14,E1,E2,E13,E14,F1,F2,F13,F14
0.20
0.85
0.25
MIN
---
56X
9.20 mm x 8.00 mm
0.15 M
0.08 M C
C1,C2,C5,C6,C9,C10,C13,C14
A1
A2 ~ A13,B1 ~ B14
J1 ~ J14, K2 ~ K13
PACKAGE
9.20 BSC.
8.00 BSC.
4.50 BSC.
6.50 BSC.
0.50 BSC.
0.25 BSC.
0.50 BSC
NLB 056
6
INDEX MARK
NOM
b
0.30
N/A
---
---
---
10
14
56
C
9
D a t a
A
SIDE VIEW
B
TOP VIEW
MAX
1.20
0.97
0.35
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S h e e t
S71NS-N MCP Products
Figure 4.4 NLB056—56-ball VFBGA
NOTE
( A d v a n c e
C
A
0.10
(2X)
E
B
C
0.08
0.20
eE
C
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
14
13
12
11
10
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,
SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
I n f o r m a t i o n )
e REPRESENTS THE SOLDER BALL GRID PITCH.
eD
SD
BOTTOM VIEW
K
7
J
H G
D1
F
S71NS-N_00_A7 March 26, 2008
E
D
C
B
A
SE
CORNER
PIN A1
3507\ 16-038.22 \ 7.14.5
7
E1