s71ns128nc0 Meet Spansion Inc., s71ns128nc0 Datasheet - Page 11

• Manufacturer Part Number: s71ns128nc0
• Description: Stacked Multi-chip Product Mcp Mirrorbit Flash Memory And Psram 256mb 16m X 16-bit / 128mb 8m X 16-bit / 64mb 4m X 16-bit 110 Nm Cmos 1.8 Volt-only, Multiplexed, Simultaneous Read/write, Burst Mode Flash Memory With 8 Mb 512k X 16-bit
• Manufacturer: Meet Spansion Inc.

March 26, 2008 S71NS-N_00_A7
4.3.2
NLA060—11.0 x 10.0 mm, 60-ball VFBGA
PACKAGE
SYMBOL
SD / SE
JEDEC
D a t a
D x E
MD
ME
D1
Øb
eD
A1
A2
E1
eE
A
D
E
n
A A2
CORNER
0.15 C
(2X)
PIN A1
F1,F2,F3,F4,F15,F16,F17,F18,G1,G2,G3,G4,G15,G16,G17,G18
H1,H2,H3,H4,H15,H16,H17,H18,J1,J2,J3,J4,J15,J16,J17,J18
D1~D18,E1,E2,E3,E4,E7,E8,E11,E12,E15,E16,E17,E18
0.20
0.85
0.25
MIN
L1 ~L18,M1,M2,M4~M15,M17,M18,N1~N18,P2~P17
---
K1,K2,K3,K4,K7,K8,K11,K12,K15,K16,K17,K18
A2~A17,B1~B18,C1,C2,C4~C15,C17,C18
S h e e t
10.95 mm x 9.95 mm
A1
60X
0.15
0.08
10.95 BSC.
PACKAGE
9.95 BSC.
6.50 BSC.
8.50 BSC.
0.50 BSC.
0.25 BSC.
0.50 BSC
NLA 060
INDEX MARK
NOM
0.30
N/A
14
18
60
---
---
---
6
M C
M C
b
9
A B
( A d v a n c e
MAX
1.20
0.97
0.35
SIDE VIEW
---
TOP VIEW
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S71NS-N MCP Products
Figure 4.5 NLA060—60-ball VFBGA
NOTE
I n f o r m a t i o n )
C
A
0.15
(2X)
E
B
C
0.20
0.08
eE
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
C
C
18
17
16
15
14
13
12
11
10
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,
SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
9
8
7
6
5
4
3
2
1
e REPRESENTS THE SOLDER BALL GRID PITCH.
eD
P N M L K J H G F E D C B
SD
BOTTOM VIEW
7
D1
A
3483 \ 16-038.22 \ 3.11.5
SE
CORNER
PIN A1
7
E1
11