saa4977h NXP Semiconductors, saa4977h Datasheet - Page 31

• Manufacturer Part Number: saa4977h
• Description: Video Processing
• Manufacturer: NXP Semiconductors

Philips Semiconductors
13.5
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
14 DATA SHEET STATUS
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
2000 May 25
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Objective specification
Preliminary specification
Product specification
DATA SHEET STATUS
Besic
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
Suitability of surface mount IC packages for wave and reflow soldering methods
, SO, SOJ
Development
Qualification
Production
PACKAGE
PRODUCT
STATUS
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
31
not suitable
not suitable
suitable
not recommended
not recommended
DEFINITIONS
WAVE
(2)
SOLDERING METHOD
(1)
(3)(4)
(5)
Preliminary specification
suitable
suitable
suitable
suitable
suitable
SAA4977H
REFLOW
(1)