hcts273ms Intersil Corporation, hcts273ms Datasheet - Page 9

• Manufacturer Part Number: hcts273ms
• Description: Radiation Hardened Octal D Flip-flop
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
108 x 106 mils
Type: AlSi
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 x 4 mils
The mask series for the HCTS273 is TA14407.
Q1 (5)
Q2 (6)
D1 (4)
D2 (7)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
D0
(3)
Å
(8)
D3
Q3
(9)
Q0
(2)
HCTS273MS
GND
(10)
HCTS273MS
MR
(1)
9
(11)
CP
VCC
(20)
(12)
Q4
(19)
Q7
(13)
D4
Spec Number
(18) D7
(17) D6
(16) Q6
(15) Q5
(14) D5
518642