tpc8129 TOSHIBA Semiconductor CORPORATION, tpc8129 Datasheet - Page 2

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tpc8129

Manufacturer Part Number
tpc8129
Description
Mosfets Silicon P-channel Mos U-mos? Tpc8129 Tpc8129
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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5. 5. 5. 5. Thermal Characteristics
Thermal Characteristics
Thermal Characteristics
Thermal Characteristics
Note 1: Ensure that the channel temperature does not exceed 150.
Note 2: Device mounted on a glass-epoxy board (a), Figure 5.1
Note 3: Device mounted on a glass-epoxy board (b), Figure 5.2
Note 4: V
Note:
Channel-to-ambient thermal resistance
Channel-to-ambient thermal resistance
Fig.
Fig.
Fig.
Fig. 5.1
This transistor is sensitive to electrostatic discharge and should be handled with care.
5.1
5.1
5.1 Device Mounted on a Glass-Epoxy
DD
= -24 V, T
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
ch
Board (a)
Board (a)
Board (a)
Board (a)
= 25 (initial), L = 0.2 mH, R
Characteristics
G
(t = 10 s)
(t = 10 s)
2
= 25 Ω, I
Fig.
Fig.
Fig.
Fig. 5.2
AR
5.2
5.2
5.2 Device Mounted on a Glass-Epoxy
= -9 A
(Note 2)
(Note 3)
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Board (b)
Board (b)
Board (b)
Board (b)
Symbol
R
R
th(ch-a)
th(ch-a)
65.7
Max
125
2010-08-25
TPC8129
Rev.1.0
/W
/W
Unit

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