tpca8064-h TOSHIBA Semiconductor CORPORATION, tpca8064-h Datasheet - Page 2
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tpca8064-h
Manufacturer Part Number
tpca8064-h
Description
Mosfets Silicon N-channel Mos U-mos-h
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
1.TPCA8064-H.pdf
(9 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TPCA8064-H
Manufacturer:
TI
Quantity:
100
Part Number:
TPCA8064-H
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
4. 4. 4. 4. Absolute Maximum Ratings (Note) (T
5. 5. 5. 5. Thermal Characteristics
Absolute Maximum Ratings (Note) (T
Absolute Maximum Ratings (Note) (T
Thermal Characteristics
Thermal Characteristics
Absolute Maximum Ratings (Note) (T
Thermal Characteristics
Note:
Note 1: Ensure that the channel temperature does not exceed 150.
Note 2: Device mounted on a glass-epoxy board (a), Figure 5.1
Note 3: Device mounted on a glass-epoxy board (b), Figure 5.2
Note 4: V
Note:
Drain-source voltage
Gate-source voltage
Drain current (DC)
Drain current (pulsed)
Power dissipation
Power dissipation
Power dissipation
Single-pulse avalanche energy
Avalanche current
Channel temperature
Storage temperature
Channel-to-case thermal resistance
Channel-to-ambient thermal resistance
Channel-to-ambient thermal resistance
Fig.
Fig.
Fig.
Fig. 5.1
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
This transistor is sensitive to electrostatic discharge and should be handled with care.
5.1
5.1
5.1 Device Mounted on a Glass-Epoxy
DD
= 24 V, T
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
ch
Board (a)
Board (a)
Board (a)
Board (a)
= 25 (initial), L = 0.2 mH, R
Characteristics
Characteristics
(T
(t = 10 s)
(t = 10 s)
c
= 25)
a a a a
= 25
= 25
= 25
= 25 unless otherwise specified)
G
(T
(t = 10 s)
(t = 10 s)
2
= 1 Ω, I
c
= 25)
(Note 1)
(Note 1)
(Note 2)
(Note 3)
(Note 4)
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
Fig.
Fig.
Fig.
Fig. 5.2
AR
= 20 A
5.2
5.2
5.2 Device Mounted on a Glass-Epoxy
(Note 2)
(Note 3)
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Symbol
V
V
E
T
T
I
I
P
P
P
DSS
GSS
I
DP
AR
D
AS
stg
ch
D
D
D
Board (b)
Board (b)
Board (b)
Board (b)
Symbol
R
R
R
th(ch-c)
th(ch-a)
th(ch-a)
-55 to 150
Rating
±20
104
150
2.8
1.6
TPCA8064-H
30
20
60
32
20
3.91
44.6
78.1
Max
2010-05-27
Rev.1.0
/W
/W
Unit
Unit
mJ
W
W
W
V
A
A