msm548263 Oki Semiconductor, msm548263 Datasheet - Page 39

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msm548263

Manufacturer Part Number
msm548263
Description
Msm548263256k X 8 Multiport Dram
Manufacturer
Oki Semiconductor
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
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Manufacturer:
OKI
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Manufacturer:
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PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
¡ Semiconductor
SOJ40-P-400-1.27
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
MSM548263
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.70 TYP.
(Unit : mm)
39/40

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