EFD25-3C85 PHILIPS [NXP Semiconductors], EFD25-3C85 Datasheet - Page 3
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EFD25-3C85
Manufacturer Part Number
EFD25-3C85
Description
EFD cores and accessories
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
1.EFD25-3C85.pdf
(6 pages)
Philips Components
COIL FORMERS
General data
Winding data for EFD25 coil former with 10-pins
1997 Nov 21
handbook, full pagewidth
Coil former material
Pin material
Maximum operating temperature
Resistance to soldering heat
Solderability
EFD cores and accessories
Dimensions in mm.
NUMBER OF
SECTIONS
12.5
max
3.6
1
PARAMETER
12
0
0.2
WINDING
13.1
11.7
25.2 max
18
(mm
AREA
40.2
20
10
0
0.2
0
0.1
0.1
0
2
)
phenolformaldehyde (PF), glass-reinforced, flame retardant in accordance with
“UL 94V-0” ; UL file number E167521(M)
copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
180 C, “IEC 85” class H
“IEC 68-2-20” , Part 2, Test Tb, method 1B, 350 C, 3.5 s
“IEC 68-2-20” , Part 2, Test Ta, method 1
5.5
0.1
0
Fig.2 EFD25 coil former; 10-pins.
MINIMUM
WINDING
6.9
WIDTH
(mm)
16.4
0
0.1
O
3
0.8
(16.4 min)
18
26.2 max
LENGTH OF
AVERAGE
22.5
0
0.2
TURN
(mm)
46.4
SPECIFICATION
CSH-EFD25-1S-10P
22.5
TYPE NUMBER
5
1.3
0.15
0
Product specification
0.05
MGC343
EFD25