SC18IM700IPW PHILIPS [NXP Semiconductors], SC18IM700IPW Datasheet
SC18IM700IPW
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SC18IM700IPW Summary of contents
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SC18IM700 Master I Rev. 01 — 28 February 2006 1. General description The SC18IM700 is designed to serve as an interface between the standard UART port of a microcontroller or microprocessor and the serial I or microprocessor to communicate directly ...
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... Philips Semiconductors 4. Ordering information Table 1: Type number SC18IM700IPW 5. Block diagram Fig 1. Block diagram of SC18IM700 SC18IM700_1 Product data sheet Master I Ordering information Package Name Description TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SC18IM700 RX TX UART RESET WAKEUP Rev. 01 — 28 February 2006 ...
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... GPIO3 SDA SCL RX TX GPIO6 V DD WAKEUP GPIO5 GPIO4 GPIO7 SC18IM700_1 Product data sheet Master I 1 GPIO0 GPIO1 2 RESET SC18IM700IPW 5 GPIO2 GPIO3 6 SDA 7 8 SCL Pin description Pin Type Description 1 I/O programmable I/O pin 2 I/O programmable I/O pin 3 I hardware reset input 4 - ground ...
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Philips Semiconductors 7. Functional description The SC18IM700 is a bridge between a UART port and I consists of a full-functional advanced UART. The UART communicates with the host through the TX and RX pins. The serial data format is fixed: ...
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Philips Semiconductors Fig 3. Write N bytes to slave device 7.1.2 Read N byte from slave device The host issues the read command by sending an S character followed slave device address, and the total number of ...
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Philips Semiconductors 7.1.4 Read from 18IM internal register The host issues the internal register read command by sending an R character followed by the registers to be read. The frame is then terminated with a P character. Once the command ...
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Philips Semiconductors Fig 9. Repeated START: read after write 7.1.8 Repeated START: write after write The SC18IM700 also supports ‘write after write’ command as specified in the Philips’ C-bus specification. This allows a write command to be sent ...
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Philips Semiconductors C-bus serial interface 2 The I C-bus uses two wires (SDA and SCL) to transfer information between devices connected to the bus, and it has the following features: • Bidirectional data transfer between masters and ...
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Philips Semiconductors 9.2 Register descriptions 9.2.1 Baud Rate Generator (BRG) The baud rate generator is an 8-bit counter that generates the data rate for the transmitter and the receiver. The rate is programmed through the BRG register and the baud ...
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Philips Semiconductors pin latch data Fig 13. Quasi-bidirectional output configuration 9.2.2.2 Input-only configuration The input-only port configuration has no output drivers Schmitt triggered input that also has a glitch suppression circuit. Fig 14. Input-only configuration 9.2.2.3 Push-pull ...
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Philips Semiconductors 9.2.2.4 Open-drain output configuration The open-drain output configuration turns off all pull-ups and only drives the pull-down transistor of the port driver when the port latch contains a logic used as a logic output, a ...
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Philips Semiconductors Table 7: I2CClk (I2CClkH + I2CClkL) 10 (minimum 100 Remark: The numbers used in the formulas are in decimal, but the numbers to program I2CClkH and I2CClkL are in hex. 2 9.2.6 I ...
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Philips Semiconductors 10. Limiting values Table 10: In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol T amb(bias) T stg OH(I/O) I OL(I/O) I I/O(tot)(max) P /pack tot [1] This product includes circuitry specifically designed ...
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Philips Semiconductors 11. Static characteristics Table 11: Static characteristics +85 C; unless otherwise specified. DD amb Symbol Parameter I supply current DD V power-on reset voltage POR V ...
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Philips Semiconductors 12. Dynamic characteristics 2 Table 12: I C-bus timing characteristics All the timing limits are valid within the operating supply voltage and ambient temperature range +85 C; and refer to V amb ...
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Philips Semiconductors 13. Package outline TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. ...
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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 17. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...