SC18IM700IPW PHILIPS [NXP Semiconductors], SC18IM700IPW Datasheet

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SC18IM700IPW

Manufacturer Part Number
SC18IM700IPW
Description
Master I-2C - bus controller with UART interface
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet

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1. General description
2. Features
3. Applications
The SC18IM700 is designed to serve as an interface between the standard UART port of
a microcontroller or microprocessor and the serial I
or microprocessor to communicate directly with other I
can operate as an I
sequences, protocol, arbitration and timing. The host communicates with SC18IM700 with
ASCII messages protocol; this makes the control sequences from the host to the
SC18IM700 become very simple.
SC18IM700
Master I
Rev. 01 — 28 February 2006
UART host interface
I
Eight programmable I/O pins
High-speed UART: baud rate up to 460.8 kbit/s
High-speed I
16-byte TXFIFO
16-byte RXFIFO
Programmable baud rate generator
2.3 V and 3.6 V operation
Sleep mode (power-down)
UART message format resembles I
I
Multi-master capability
5 V tolerance on the input pins
8 N 1 UART format (8 data bits, no parity bit, 1 stop bit)
Available in very small TSSOP16 package
Enable I
I
Industrial control
Medical equipment
Cellular telephones
Handheld computers
2
2
2
C-bus controller
C-bus master functions
C-bus instrumentation and control
2
C-bus master support in a system
2
C-bus controller with UART interface
2
C-bus: 400 kbit/s
2
C-bus master. The SC18IM700 controls all the I
2
C-bus transaction format
2
C-bus; this allows the microcontroller
2
C-bus devices. The SC18IM700
Product data sheet
2
C-bus specific

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SC18IM700IPW Summary of contents

Page 1

SC18IM700 Master I Rev. 01 — 28 February 2006 1. General description The SC18IM700 is designed to serve as an interface between the standard UART port of a microcontroller or microprocessor and the serial I or microprocessor to communicate directly ...

Page 2

... Philips Semiconductors 4. Ordering information Table 1: Type number SC18IM700IPW 5. Block diagram Fig 1. Block diagram of SC18IM700 SC18IM700_1 Product data sheet Master I Ordering information Package Name Description TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SC18IM700 RX TX UART RESET WAKEUP Rev. 01 — 28 February 2006 ...

Page 3

... GPIO3 SDA SCL RX TX GPIO6 V DD WAKEUP GPIO5 GPIO4 GPIO7 SC18IM700_1 Product data sheet Master I 1 GPIO0 GPIO1 2 RESET SC18IM700IPW 5 GPIO2 GPIO3 6 SDA 7 8 SCL Pin description Pin Type Description 1 I/O programmable I/O pin 2 I/O programmable I/O pin 3 I hardware reset input 4 - ground ...

Page 4

Philips Semiconductors 7. Functional description The SC18IM700 is a bridge between a UART port and I consists of a full-functional advanced UART. The UART communicates with the host through the TX and RX pins. The serial data format is fixed: ...

Page 5

Philips Semiconductors Fig 3. Write N bytes to slave device 7.1.2 Read N byte from slave device The host issues the read command by sending an S character followed slave device address, and the total number of ...

Page 6

Philips Semiconductors 7.1.4 Read from 18IM internal register The host issues the internal register read command by sending an R character followed by the registers to be read. The frame is then terminated with a P character. Once the command ...

Page 7

Philips Semiconductors Fig 9. Repeated START: read after write 7.1.8 Repeated START: write after write The SC18IM700 also supports ‘write after write’ command as specified in the Philips’ C-bus specification. This allows a write command to be sent ...

Page 8

Philips Semiconductors C-bus serial interface 2 The I C-bus uses two wires (SDA and SCL) to transfer information between devices connected to the bus, and it has the following features: • Bidirectional data transfer between masters and ...

Page 9

Philips Semiconductors 9.2 Register descriptions 9.2.1 Baud Rate Generator (BRG) The baud rate generator is an 8-bit counter that generates the data rate for the transmitter and the receiver. The rate is programmed through the BRG register and the baud ...

Page 10

Philips Semiconductors pin latch data Fig 13. Quasi-bidirectional output configuration 9.2.2.2 Input-only configuration The input-only port configuration has no output drivers Schmitt triggered input that also has a glitch suppression circuit. Fig 14. Input-only configuration 9.2.2.3 Push-pull ...

Page 11

Philips Semiconductors 9.2.2.4 Open-drain output configuration The open-drain output configuration turns off all pull-ups and only drives the pull-down transistor of the port driver when the port latch contains a logic used as a logic output, a ...

Page 12

Philips Semiconductors Table 7: I2CClk (I2CClkH + I2CClkL) 10 (minimum 100 Remark: The numbers used in the formulas are in decimal, but the numbers to program I2CClkH and I2CClkL are in hex. 2 9.2.6 I ...

Page 13

Philips Semiconductors 10. Limiting values Table 10: In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol T amb(bias) T stg OH(I/O) I OL(I/O) I I/O(tot)(max) P /pack tot [1] This product includes circuitry specifically designed ...

Page 14

Philips Semiconductors 11. Static characteristics Table 11: Static characteristics +85 C; unless otherwise specified. DD amb Symbol Parameter I supply current DD V power-on reset voltage POR V ...

Page 15

Philips Semiconductors 12. Dynamic characteristics 2 Table 12: I C-bus timing characteristics All the timing limits are valid within the operating supply voltage and ambient temperature range +85 C; and refer to V amb ...

Page 16

Philips Semiconductors 13. Package outline TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. ...

Page 17

Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

Page 18

Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

Page 19

Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

Page 20

Philips Semiconductors 17. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 21

Philips Semiconductors 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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