SC18IM700IPW PHILIPS [NXP Semiconductors], SC18IM700IPW Datasheet - Page 16

• Manufacturer Part Number: SC18IM700IPW
• Description: Master I-2C - bus controller with UART interface
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
13. Package outline
Fig 18. Package outline SOT403-1 (TSSOP16)
SC18IM700_1
Product data sheet
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT403-1
max.
1.1
A
0.15
0.05
A
1
16
1
0.95
0.80
A
2
y
IEC
Z
0.25
pin 1 index
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
9
8
Rev. 01 — 28 February 2006
D
5.1
4.9
0
(1)
w
E
4.5
4.3
M
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
2
E
Master I
A
1
5 mm
L
1
0.75
0.50
L
2
H
C-bus controller with UART interface
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
SC18IM700
w
X
v
0.1
A
y
M
ISSUE DATE
A
99-12-27
03-02-18
0.40
0.06
Z
(1)
SOT403-1
8
0
o
o
16 of 21