P304 PHILIPS [NXP Semiconductors], P304 Datasheet - Page 2

no-image

P304

Manufacturer Part Number
P304
Description
Smart eID
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
P3041NSE1MMB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
P3041NSE1NNB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
P3041NSE1PNB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
P3041NSN1MMB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
P3041NSN1NNB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
P3041NXN1PNB
Manufacturer:
VISHAY
Quantity:
12 000
Part Number:
P3041NXN7MMC
Manufacturer:
FREESCALE
Quantity:
101
Part Number:
P3041PSE1MZA
Manufacturer:
FREESCA
Quantity:
648
Part Number:
P304APSE1MZA
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
P304ASXE1HLB
Manufacturer:
FREESCA
Quantity:
1
NXP Semiconductors
2. Features
P304_P308_P310G002_FAM_SDS_1
Product short data sheet
1.4.1 Hardware platform
1.3 Naming convention
1.4 Architecture overview
2.1 Standard family features
Table 1.
Every member of the Smart eID product family consists of hardware and software
components. The overall deliverable is a module for integration into a contactless smart
card or other contactless device. This module comes pre-configured with application
software and is ready to be personalized by NXP Semiconductors direct or indirect
customers.
Every member of the Smart eID product family uses a proven, NXP-developed smart card
processor as the physical basis for its implementation. Chips are packaged in standard
modules ready to be bonded to an antenna coil and embedded in contactless cards.
NXP Semiconductors reserves the right to change aspects of manufacturing technology,
including, but not limited to: silicon chip design, silicon die size, choice of silicon
technology, silicon chip packaging. All aspects of the hardware platform relevant to NXP
Semiconductors direct or indirect customers are documented in the full data sheet and
other documents available for the Smart eID product family and its individual members.
I
I
I
I
I
I
I
I
I
I
P3xxG002zz Smart eID platform
xx
zz
EEPROM: choice of 4 KB, 8 KB, 10 KB
ISO/IEC 7816 LDS-compatible file system implementation supporting open access,
BAC and BAC plus operating modes
Configurable authentication and security settings to match customer system
requirements
Configurable access conditions for elementary files
Possible activation of the UPDATE BINARY command in BAC plus operating mode
Life cycle management system
ISO/IEC 7816-4 compliant subset of the commands for file manipulation
Proprietary commands for easier personalization and transport key exchange
Flexible support for one fixed functionality ID capable application
Flexible file system based on ICAO LDS structure
N
N
Data retention time: 20 years minimum
Endurance: 100 000 cycles minimum
Naming convention
amount of non-volatile memory in KB, increasing count for further product options
package type
Rev. 01 — 29 July 2008
P304/P308/P310G002 family
© NXP B.V. 2008. All rights reserved.
Smart eID
2 of 8

Related parts for P304