74AHC2G08DP,125 NXP Semiconductors, 74AHC2G08DP,125 Datasheet

IC DUAL 2-INPUT AND GATE 8TSSOP

74AHC2G08DP,125

Manufacturer Part Number
74AHC2G08DP,125
Description
IC DUAL 2-INPUT AND GATE 8TSSOP
Manufacturer
NXP Semiconductors
Series
74AHCr
Datasheet

Specifications of 74AHC2G08DP,125

Number Of Circuits
2
Package / Case
8-TSSOP
Logic Type
AND Gate
Number Of Inputs
2
Current - Output High, Low
8mA, 8mA
Voltage - Supply
2 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Product
AND
Logic Family
AHC
High Level Output Current
- 8 mA
Low Level Output Current
8 mA
Propagation Delay Time
3.2 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
74AHC2G08DP-G
74AHC2G08DP-G
935274676125
1. General description
2. Features
3. Ordering information
Table 1.
Type number
74AHC2G08DP
74AHCT2G08DP
74AHC2G08DC
74AHCT2G08DC
74AHC2G08GD
74AHCT2G08GD
Ordering information
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
The 74AHC2G08; 74AHCT2G08 is a high-speed Si-gate CMOS device.
The 74AHC2G08; 74AHCT2G08 provides two 2-input AND gates.
I
I
I
I
I
I
I
74AHC2G08; 74AHCT2G08
Dual 2-input AND gate
Rev. 03 — 12 January 2009
Symmetrical output impedance
High noise immunity
ESD protection:
Low power dissipation
Balanced propagation delays
Multiple package options
Specified from 40 C to +85 C and from 40 C to +125 C
N
N
N
HBM JESD22-A114E exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101C exceeds 1000 V
TSSOP8
VSSOP8
XSON8U
Description
plastic thin shrink small outline package; 8 leads; body
width 3 mm; lead length 0.5 mm
plastic very thin shrink small outline package; 8 leads;
body width 2.3 mm
plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3
2
0.5 mm
Product data sheet
Version
SOT505-2
SOT765-1
SOT996-2

Related parts for 74AHC2G08DP,125

74AHC2G08DP,125 Summary of contents

Page 1

Dual 2-input AND gate Rev. 03 — 12 January 2009 1. General description The 74AHC2G08; 74AHCT2G08 is a high-speed Si-gate CMOS device. The 74AHC2G08; 74AHCT2G08 provides two 2-input AND gates. 2. Features I Symmetrical output impedance I High ...

Page 2

... NXP Semiconductors 4. Marking Table 2. Marking Type number 74AHC2G08DP 74AHCT2G08DP 74AHC2G08DC 74AHCT2G08DC 74AHC2G08GD 74AHCT2G08GD 5. Functional diagram mna724 Fig 1. Logic symbol. Fig 3. Logic diagram (one gate). 74AHC_AHCT2G08_3 Product data sheet 74AHC2G08; 74AHCT2G08 Marking code A08 C08 A08 C08 A08 C08 Fig Rev. 03 — 12 January 2009 ...

Page 3

... NXP Semiconductors 6. Pinning information 6.1 Pinning 74AHC2G08 74AHCT2G08 GND 4 001aaj389 Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) 6.2 Pin description Table 3. Pin description Symbol Pin 1A 1B GND 4 1Y Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level. ...

Page 4

... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I I input clamping current IK I output clamping current OK I output current O I supply current ...

Page 5

... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74AHC2G08 V HIGH-level input voltage LOW-level input voltage HIGH-level output voltage 4.0 mA 8.0 mA LOW-level output voltage 4.0 mA 8.0 mA input leakage GND; ...

Page 6

... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I supply current 5 additional per input pin supply current other inputs input I capacitance 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V; for test circuit see Figure Symbol Parameter Conditions ...

Page 7

... NXP Semiconductors Table 8. Dynamic characteristics GND = 0 V; for test circuit see Figure Symbol Parameter Conditions 74AHCT2G08 t propagation nA nY; see pd delay power per buffer; PD dissipation pF capacitance V = GND [ the same as t and PLH PHL [2] Typical values are measured at V [3] Typical values are measured at V ...

Page 8

... NXP Semiconductors negative positive Test data is given in Table Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 7. Test circuit for measuring switching times Table 10. Test data Type Input ...

Page 9

... NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...

Page 10

... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...

Page 11

... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 mm 0.5 0.00 0.15 1.9 OUTLINE VERSION IEC SOT996 Fig 10. Package outline SOT996-2 (XSON8U) ...

Page 12

... Data sheet status Product data sheet The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Added type number 74AHC2G08GD and 74AHCT2G08GD (XSON8U package). ...

Page 13

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 14

... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 Abbreviations ...

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