UPD705100GJ-100-8 NEC [NEC], UPD705100GJ-100-8 Datasheet - Page 62

• Manufacturer Part Number: UPD705100GJ-100-8
• Description: V830TM 32-BIT MICROCONTROLLER
• Manufacturer: NEC [NEC]

62
15. RECOMMENDED SOLDERING CONDITIONS
Technology Manual (C10535E).
different conditions.
Infrared ray reflow
VPS
Partial heating method
The conditions listed below shall be met when soldering the PD705100.
For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
Note Maximum number of days during which the product can be stored at a temperature of 25 C and a relative
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
Soldering process
humidity of 65 % or less after dry-pack package is opened.
method for terminal sections).
Table 15-1. Soldering Conditions for Surface-Mount Devices
Peak package’s surface temperature: 235 C
Reflow time: 30 seconds or less (210 C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 3 days
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Peak package’s surface temperature: 215 C
Reflow time: 40 seconds or less (200 C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 3 days
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Terminal temperature: 300 C or less
Heat time: 3 seconds or less (for one side of a device)
Note
Note
Soldering conditions
(10 hours of pre-baking is required at 125 C
(10 hours of pre-baking is required at 125 C
IR35-103-2
VP15-103-2
Symbol
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PD705100