MTB6N60 MOTOROLA [Motorola, Inc], MTB6N60 Datasheet
MTB6N60
Available stocks
Related parts for MTB6N60
MTB6N60 Summary of contents
Page 1
... Preferred devices are Motorola recommended choices for future use and best overall value. REV 2 Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1997 D G Rating 10 ms) Order this document by MTB6N60E/D MTB6N60E Motorola Preferred Device TMOS POWER FET 6.0 AMPERES 600 VOLTS R DS(on) = 1.2 OHM CASE 418B–03, Style PAK ...
Page 2
... MTB6N60E ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage ( Vdc 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( 600 Vdc Vdc 600 Vdc Vdc 125 C) Gate– ...
Page 3
... Figure 4. On–Resistance versus Drain Current 10000 1000 100 10 1 100 125 150 0 100 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 6. Drain–To–Source Leakage MTB6N60E 100 – 3.0 3.5 4.0 4.5 5.0 5.5 6 DRAIN CURRENT (AMPS) ...
Page 4
... MTB6N60E Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are deter- mined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculat- ing rise and fall because drain– ...
Page 5
... DM ), the energy rating is specified at rated continuous cur- rent ( accordance with industry custom. The energy rat- ing must be derated for temperature as shown in the accompanying graph (Figure 12). Maximum energy at cur- rents below rated continuous I D can safely be assumed to equal the values indicated. MTB6N60E t d(off d(on) 10 ...
Page 6
... MTB6N60E 100 SINGLE PULSE 100 1 DS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.1 0 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 11. Maximum Rated Forward Biased Safe Operating Area 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 0.01 0.00001 0.0001 di/ 0. ...
Page 7
... Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. MTB6N60E Board Material = 0.0625 G–10/FR– Copper ...
Page 8
... MTB6N60E Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of brass or stainless steel. For packages such as the SC–59, SC– ...
Page 9
... C 160 C 150 C SOLDER IS LIQUID FOR SECONDS 100 C 140 C (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES Figure 18. Typical Solder Heating Profile MTB6N60E STEP 6 STEP 7 VENT COOLING 205 TO 219 C PEAK AT SOLDER JOINT T MAX 9 ...
Page 10
... Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.340 0.380 8.64 9.65 B 0.380 0.405 9.65 10.29 C 0.160 0.190 4.06 4.83 D 0.020 0.035 0.51 0.89 E 0.045 0.055 1.14 1.40 G 0.100 BSC 2.54 BSC H 0.080 0.110 2.03 2.79 J 0.018 0.025 0.46 0.64 K 0.090 0.110 2.29 2.79 S 0.575 0.625 14.60 15.88 V 0.045 0.055 1.14 1.40 Mfax is a trademark of Motorola, Inc. MTB6N60E/D ...