UPC8179TB-E3 NEC, UPC8179TB-E3 Datasheet - Page 26

• Manufacturer Part Number: UPC8179TB-E3
• Description: SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS
• Manufacturer: NEC

NOTES ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
26
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Method
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) The bypass capacitor should be attached to V
(4) The inductor (L) should be attached between output and V
(5) The DC capacitor must be attached to input pin.
This product should be soldered under the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
should be adjusted for applied frequency to match impedance to next stage.
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limit: None
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limit: None
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
Soldering Conditions
Data Sheet P14730EJ2V0DS00
Note
Note
Note
CC
line.
CC
pins. The L and series capacitor (C) values
Recommended Condition Symbol
For soldering methods and
WS60-00-1
VP15-00-3
IR35-00-3
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PC8179TB