HEF4043BT NXP [NXP Semiconductors], HEF4043BT Datasheet
HEF4043BT
Available stocks
Related parts for HEF4043BT
HEF4043BT Summary of contents
Page 1
... All types operate from +85 C. Type number Package Name HEF4043BP DIP16 HEF4043BT SO16 3. When OE is LOW, the latch outputs are in the high impedance OFF-state. OE power supply range referenced Description plastic dual in-line package; 16-leads (300 mil) plastic small outline package ...
Page 2
NXP Semiconductors 5. Functional diagram 3-STATE OUTPUTS Fig 1. Functional diagram 6. Pinning information 6.1 Pinning Fig 3. Pin configuration HEF4043B_6 Product ...
Page 3
NXP Semiconductors 6.2 Pin description Table 2. Pin description Symbol Pin ...
Page 4
NXP Semiconductors 9. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter V supply voltage DD V input voltage I T ambient temperature amb t/ V input transition rise and fall rate 10. Static characteristics Table 6. Static characteristics ...
Page 5
NXP Semiconductors Table 6. Static characteristics unless otherwise specified Symbol Parameter I supply current DD C input capacitance I 11. Dynamic characteristics Table 7. Dynamic characteristics V ...
Page 6
NXP Semiconductors Table 8. Dynamic power dissipation P P can be calculated from the formulas shown Symbol Parameter dynamic power dissipation 12. Waveforms t and t are the ...
Page 7
NXP Semiconductors OE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in Fig 5. Output enable (OE) to latch output (nQ) enable time (t Table 9. Measurement points Supply voltage Input ...
Page 8
NXP Semiconductors Test and measurement data is given in Definitions test circuit: DUT = Device Under Test Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance. L Fig ...
Page 9
NXP Semiconductors 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...
Page 10
NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 ...
Page 11
NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 15. Revision history Table 12. Revision history Document ID Release date HEF4043B_6 20081111 • Modifications: Maximum T ...
Page 12
NXP Semiconductors 16. Legal information 16.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
Page 13
NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...