TDA8595J NXP [NXP Semiconductors], TDA8595J Datasheet

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TDA8595J

Manufacturer Part Number
TDA8595J
Description
Manufacturer
NXP [NXP Semiconductors]
Datasheet

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TDA8595J
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1. General description
2. Features
2.1 General
2.2 I
The TDA8595 is a complementary quad Bridge Tied Load (BTL) audio power amplifier
made in BCDMOS technology. It contains four independent amplifiers in BTL
configuration. Through the I
fully programmable and the information available via two diagnostic pins is selectable. The
status of each amplifier (output offset, load or no load, short-circuit or speaker incorrectly
connected) can be read separately.
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
2
C-bus mode
TDA8595
I
Rev. 02 — 21 November 2007
Operates in legacy mode (non I
Three hardware-programmable I
Drive 4
Speaker fault detection
Independent short-circuit protection per channel
Loss of ground and open V
decoupling capacitor of 2200 F maximum)
All outputs short-circuit proof to ground, supply voltage and across the load
All pins short-circuit proof to ground
Temperature-controlled gain reduction to prevent audio holes at high junction
temperatures
Low battery voltage detection
Offset detection
This part has been qualified in accordance with AEC-Q100
DC load detection: open-circuit, short-circuit and load present
AC load (tweeter) detection
During start-up, can detect which load is connected so the appropriate gain can be
selected without audio pop
Independently selectable soft mute of front channels (channel 1 and channel 3) and
rear channels (channel 2 and channel 4)
Programmable gain (26 dB and 16 dB) of front channels and rear channels
Fully programmable diagnostic levels can be set:
2
N
N
C-bus controlled 4
Programmable clip detection: 2 %, 5 % or 10 %
Programmable thermal pre-warning
or 2
loads
2
C-bus, diagnosis of temperature warning and clipping level is
P
safe (with 150 m series impedance and a supply
45 W power amplifier
2
C-bus) and I
2
C-bus addresses
2
C-bus mode (3.3 V and 5 V compliant)
Product data sheet

Related parts for TDA8595J

TDA8595J Summary of contents

Page 1

TDA8595 2 I C-bus controlled 4 Rev. 02 — 21 November 2007 1. General description The TDA8595 is a complementary quad Bridge Tied Load (BTL) audio power amplifier made in BCDMOS technology. It contains four independent amplifiers in BTL configuration. ...

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... Refer to test circuit (see normal mode; unless otherwise specified. Tested at T +105 C. Symbol THD V n(o) 4. Ordering information Table 2. Type number TDA8595J TDA8595TH TDA8595SD TDA8595_2 Product data sheet Quick reference data Figure 30 Parameter Conditions supply voltage ...

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... I C-BUS CLIP DETECT/DIAGNOSTIC INTERFACE MUTE 26 dB MUTE 26 dB MUTE 26 dB MUTE 26 dB TDA8595J TDA8595SD (TDA8595TH) 11 (5) 14 (9) 17 (13) 9 (3) SVR SGND ACGND PGND1 Rev. 02 — 21 November 2007 TDA8595 2 I C-bus controlled power amplifier V ...

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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Pin configuration TDA8595J and TDA8595SD TDA8595_2 Product data sheet 2 I C-bus controlled 4 ADSEL 1 STB 2 3 PGND2 4 OUT2 DIAG 5 OUT2 OUT1 8 PGND1 9 OUT1 SVR IN1 12 IN2 13 TDA8595J 14 SGND TDA8595SD 15 IN4 IN3 16 ACGND ...

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... DIAG 33 32 OUT2 PGND2 31 OUT2 STB 28 ADSEL TDA8595TH n.c. 27 SDA 26 25 OUT4+ PGND4 24 OUT4 23 SCL n.c. 19 Pin description Pin TDA8595J TDA8595TH [1] TDA8595SD and Rev. 02 — ...

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... ADSEL pin. If the ADSEL pin is short-circuit to ground, the TDA8595 operates in legacy mode. In this mode two level (Standby mode and On mode three level pin (Standby mode, On mode and mute). TDA8595_2 Product data sheet Pin description …continued Pin TDA8595J TDA8595TH [1] TDA8595SD - ...

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NXP Semiconductors 7.1 Input stage The input stage is a high-impedance pseudo-differential input stage. The negative inputs of the four channels are combined on the ACGND pin. For the best performance on supply voltage ripple rejection and pop noise, the ...

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NXP Semiconductors 7.6 Speaker protection To prevent damage of the speaker when one side of the speaker is connected to ground, a missing current protection is implemented. When in one channel the current in the high side power is not ...

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NXP Semiconductors When the amplifier is switched off by pulling the STB pin LOW, the amplifier is first muted (fast mute) and then the capacitor on the SVR pin is discharged. With an SVR capacitor the standby ...

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NXP Semiconductors V P DIAG DB2 bit D7 POR IB1 bit D0 start enable t wake STB SVR t t amp_on amplifier output t d(mute_off) Fig 5. Start-up and shut-down timing with DC load active in I TDA8595_2 Product data ...

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NXP Semiconductors V P DIAG DB2 bit D7 POR IB1 bit D0 start enable t wake STB SVR t load t amp_on amplifier output t d(mute_off) Fig 6. Start-up and shut-down timing with low audible pop and DC load activated ...

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NXP Semiconductors V P DIAG on STB mute standby SVR t amp_on amplifier output t d(mute_off) Fig 7. Start-up and shut-down timing in legacy mode 7.9 Power-on reset and supply voltage spikes C-bus mode the supply ...

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NXP Semiconductors When the SVR capacitor has discharged, the amplifier starts up again if the V above the low V outputs of the amplifier remain low typically 5 V, results in setting bit DB2[D7]. The amplifiers will not ...

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NXP Semiconductors 2 V legacy and I C-bus mode O (V) 14.4 8.8 8.6 7.2 3.5 output voltage (1) Headroom protection activated: a) Fast mute b) Discharge of SVR. (2) Low V mute activated. P (3) Low V mute released. ...

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NXP Semiconductors C-bus mode only O (V) 14.4 8.8 8.6 7.2 5.0 3.5 output voltage 0 POR IB1 bit D0 DIAG (1) Low V mute activated. P Power-On Reset ( ( level at which ...

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NXP Semiconductors G (dB) Fig 11. Temperature controlled amplifier gain 7.13 Diagnostics Diagnostic information can be read via the I DIAG pin or on the STB pin. The DIAG pin has both fixed information (power-on reset occurred, low battery and ...

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NXP Semiconductors Table 4. Diagnostic information Speaker protection (missing current) Offset detection Load detection Overvoltage 7.14 Offset detection The offset detection can be performed with no input signal (for instance when the DSP is in mute after a start-up) or ...

Page 18

NXP Semiconductors Fig 13. DC load detection levels If the amplifier is used as line driver and the external booster has an input impedance of more than 100 DBx[D5:D4] = 10, independent of the gain setting (see Table 5. DC ...

Page 19

NXP Semiconductors The interpretation of line driver and normal mode DC load bit setting for AC load detection is shown in Table 6. DBx[D4 When bit IB1[D2 the AC load detection is enabled. The AC load ...

Page 20

NXP Semiconductors C-bus specification Table 7. Pin ADSEL Open ground ground Ground SDA SCL Fig 15. Definition of START and STOP conditions Fig 16. Bit transfer TDA8595_2 Product data sheet TDA8595 ...

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NXP Semiconductors 2 I C-BUS WRITE SCL 1 2 MSB MSB 1 SDA S ADDRESS 2 I C-BUS READ SCL 1 2 MSB MSB 1 SDA S ADDRESS : generated by master (microcontroller) : generated by slave S : START ...

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NXP Semiconductors Table 8. Bit Table 9. Bit D7 and TDA8595_2 Product data sheet Instruction byte IB1 …continued Description channel 4 clip information on DIAG or STB pin 0 ...

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NXP Semiconductors Table 9. Bit D0 Table 10. Bit 8.2 Data bytes 2 I C-bus mode: • the TDA8595 sends four data bytes to the microprocessor: DB1, DB2, ...

Page 24

NXP Semiconductors Table 11. Bit and Table 12. Bit D7 D6 TDA8595_2 Product data sheet Data byte DB1 Description temperature pre-warning warning 1 = junction temperature too high speaker ...

Page 25

NXP Semiconductors Table 12. Bit D5 and Table 13. Bit D7 D6 TDA8595_2 Product data sheet Data byte DB2 …continued Description channel 4 DC load or AC load detection if bit IB1[D2 ...

Page 26

NXP Semiconductors Table 13. Bit D5 and Table 14. Bit and D4 TDA8595_2 Product data sheet Data byte DB3 …continued Description channel 1 DC load or AC load detection if bit IB1[D2] ...

Page 27

NXP Semiconductors Table 14. Bit Limiting values Table 15. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P(r) I OSM I ORM T j(max) T stg T amb V ...

Page 28

... NXP Semiconductors Table 15. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot V esd 10. Thermal characteristics Table 16. Symbol TDA8595J; TDA8595SD R th(j-c) R th(j-a) TDA8595TH R th(j-c) R th(j-a) 11. Characteristics Table 17. Characteristics Refer to test circuit (see Figure 30 specified. Tested guaranteed for T ...

Page 29

NXP Semiconductors Table 17. Characteristics …continued Refer to test circuit (see Figure 30 specified. Tested guaranteed for T amb Symbol Parameter R load resistance tolerance L(tol) Mode select and second clip detection: pin ...

Page 30

NXP Semiconductors Table 17. Characteristics …continued Refer to test circuit (see Figure 30 specified. Tested guaranteed for T amb Symbol Parameter t amplifier on time amp_on t amplifier switch-off time off t mute ...

Page 31

NXP Semiconductors Table 17. Characteristics …continued Refer to test circuit (see Figure 30 specified. Tested guaranteed for T amb Symbol Parameter f SCL clock frequency SCL R resistance on pin ADSEL ADSEL Diagnostic ...

Page 32

NXP Semiconductors Table 17. Characteristics …continued Refer to test circuit (see Figure 30 specified. Tested guaranteed for T amb Symbol Parameter Amplifier P output power o THD total harmonic distortion channel separation cs ...

Page 33

NXP Semiconductors Table 17. Characteristics …continued Refer to test circuit (see Figure 30 specified. Tested guaranteed for T amb Symbol Parameter Z input impedance i mute attenuation mute V RMS mute output voltage ...

Page 34

NXP Semiconductors THD (%) ( kHz. ( 100 Hz. ( kHz. Fig 19. Total harmonic distortion as a function of output power (W) (1) THD = 10 %. (2) THD ...

Page 35

NXP Semiconductors P (W) (1) THD = 10 %. (2) THD = 0.5 %. Fig 21. Output power as a function of frequency (W) (1) P (2) THD = 10 %. (3) THD = 0.5 %. Fig 22. ...

Page 36

NXP Semiconductors P (W) (1) P (2) THD = 10 %. (3) THD = 0.5 %. Fig 23. Output power as a function of supply voltage; 2 THD (%) (1) P (2) P Fig 24. Total harmonic distortion as a ...

Page 37

NXP Semiconductors THD (%) (1) V (2) V Fig 25. Total harmonic distortion as a function of frequency; line driver mode SVRR (dB) Fig 26. Supply voltage ripple rejection as a function of frequency TDA8595_2 Product data sheet 1 10 ...

Page 38

NXP Semiconductors (dB) Fig 27. Channel separation as a function of frequency (W) Fig 28. Power dissipation as a function of output power; 4 TDA8595_2 Product data sheet 100 ...

Page 39

NXP Semiconductors (W) Fig 29. Power dissipation as a function of output power; 2 TDA8595_2 Product data sheet 100 14 kHz. P ...

Page 40

... C-BUS FAST MUTE INTERFACE MUTE 26 dB MUTE 26 dB MUTE 26 dB MUTE 26 dB TDA8595J TDA8595SD (TDA8595TH) 11 (5) 14 (9) 17 (13) SVR SGND ACGND (2) (3) ( 2.2 F resistor should first be connected to SGND before connecting to PGND. ADSEL input capacitor value. 4 Rev. 02 — 21 November 2007 ...

Page 41

NXP Semiconductors Fig 31. Beep input circuit (gain = 0 dB) to apply a microcontroller beep signal to all four Fig 32. Complex loads for measuring THD in line driver mode Fig 33. Circuit for combined STB and clip detection ...

Page 42

... NXP Semiconductors 13.1 PCB layout Fig 34. PCB layout of test and application circuit for TDA8595J or TDA8595SD; copper Fig 35. PCB layout of test and application circuit for TDA8595J or TDA8595SD; copper TDA8595_2 Product data sheet top layer top layer bottom (top view) Rev. 02 — 21 November 2007 ...

Page 43

... Fig 36. PCB layout of test and application circuit for TDA8595J or TDA8595SD Fig 37. PCB layout of test and application circuit for TDA8595J or TDA8595SD; 14. Test information 14.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 - Stress test qualification for integrated circuits , and is suitable for use in automotive applications ...

Page 44

NXP Semiconductors 15. Package outline DBS27P: plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm DIMENSIONS (mm are the original dimensions) (1) UNIT ...

Page 45

NXP Semiconductors HSOP36: plastic, heatsink small outline package; 36 leads; low stand-off height pin 1 index DIMENSIONS (mm are the original dimensions) A (1) UNIT max ...

Page 46

NXP Semiconductors RDBS27P: plastic rectangular-DIL-bent-SIL (reverse bent) power package; 27 leads (row spacing 2.54 mm DIMENSIONS (mm are the original dimensions) UNIT 4.65 0.60 0.5 29.2 mm 13.5 4.35 0.45 ...

Page 47

NXP Semiconductors 16. Mounting Fig 41. SOT878-1 reflow soldering footprint 17. Abbreviations Table 18. Acronym BCDMOS BTL CMOS DMOS DSP EMC ESR NMOS PMOS POR SOAR SOI TDA8595_2 Product data sheet hole diameter min. 0.92 Dimensions in ...

Page 48

NXP Semiconductors 18. Revision history Table 19. Revision history Document ID Release date TDA8595_2 20071121 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have ...

Page 49

NXP Semiconductors 19. Legal information 19.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

Page 50

NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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