PCA9306D PHILIPS [NXP Semiconductors], PCA9306D Datasheet
PCA9306D
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PCA9306D Summary of contents
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PCA9306 Dual bidirectional I Rev. 02 — 21 February 2007 1. General description The PCA9306 is a dual bidirectional I enable (EN) input, and is operational from 1 3 bias(ref)(2) The PCA9306 allows bidirectional voltage ...
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NXP Semiconductors All channels have the same electrical characteristics and there is minimal deviation from one output to another in voltage or propagation delay. This is a benefit over discrete transistor voltage translation solutions, since the fabrication of the switch ...
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... VSSOP8 [4] PCA9306GM P6X XQFN8 [1] Also known as MSOP8. [2] Same footprint and pinout as the Texas Instruments PCA9306DCT. [3] Same footprint and pinout as the Texas Instruments PCA9306DCU. [4] ‘X’ will change based on date code. 4. Functional diagram Fig 1. Logic diagram of PCA9306 (positive logic) PCA9306_2 Product data sheet ...
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... C-bus and SMBus voltage-level translator GND 1 VREF1 2 PCA9306DP SCL1 3 SDA1 4 002aac373 Fig 3. Pin configuration for TSSOP8 (MSOP8) GND 1 VREF1 2 PCA9306DC1 3 SCL1 SDA1 4 002aab843 Fig 5. Pin configuration for VSSOP8 (DC1) terminal 1 index area GND 1 PCA9306GM VREF1 2 SCL1 3 Transparent top view Fig 7. Pin confi ...
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NXP Semiconductors 5.2 Pin description Table 2. Symbol GND VREF1 SCL1 SDA1 SDA2 SCL2 VREF2 EN 6. Functional description Refer to 6.1 Function table Table HIGH level LOW level. Input [1] EN ...
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NXP Semiconductors 7. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Over operating free-air temperature range. Symbol V ref(1) V bias(ref)( I stg [1] The input ...
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NXP Semiconductors 9. Static characteristics Table 6. Static characteristics +85 C, unless otherwise specified. amb Symbol Parameter V input clamping voltage IK I HIGH-level input current IH C input capacitance on pin EN i(EN) C ...
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NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics (translating down +85 C, unless otherwise specified. Values guaranteed by design. amb Symbol Parameter Conditions ...
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NXP Semiconductors 11. Application information (1) The applied voltages at V Fig 9. Typical application circuit (switch always enabled) (1) In the Enabled mode, the applied enable voltage and the applied voltage at V Fig 10. Typical application circuit (switch ...
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NXP Semiconductors 11.1 Bidirectional translation For the bidirectional clamping configuration (higher voltage to lower voltage or lower voltage to higher voltage), the EN input must be connected to VREF2 and both pins pulled to HIGH side V regulate the EN ...
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NXP Semiconductors Table 10. Calculated for V V pu( 3.3 V 2.5 V 1.8 V 1.5 V 1.2 V [1] + compensate for V PCA9306_2 Product data sheet Dual bidirectional I Pull-up resistor values = 0.35 ...
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NXP Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 ...
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NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions ...
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NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 ...
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NXP Semiconductors XQFN8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal 1 index area ...
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NXP Semiconductors 13. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering ...
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NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including ...
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NXP Semiconductors Fig 16. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Abbreviations Table 13. Acronym CDM ESD HBM 2 I C-bus I/O ...
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NXP Semiconductors 16. Legal information 16.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...