TDA9898HL/V3 NXP [NXP Semiconductors], TDA9898HL/V3 Datasheet - Page 103
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TDA9898HL/V3
Manufacturer Part Number
TDA9898HL/V3
Description
Multistandard hybrid IF processing
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.TDA9898HLV3.pdf
(103 pages)
NXP Semiconductors
22. Contents
1
2
2.1
2.2
2.3
2.4
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.4
8.5
8.6
8.7
8.7.1
8.7.2
8.8
8.9
8.10
9
9.1
9.2
9.2.1
9.2.2
10
11
12
12.1
12.2
13
14
15
16
16.1
16.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 7
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pinning information . . . . . . . . . . . . . . . . . . . . . 12
Functional description . . . . . . . . . . . . . . . . . . 15
I
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 39
Thermal characteristics. . . . . . . . . . . . . . . . . . 39
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 40
Application information. . . . . . . . . . . . . . . . . . 90
Test information . . . . . . . . . . . . . . . . . . . . . . . . 94
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 95
Soldering of SMD packages . . . . . . . . . . . . . . 97
2
C-bus control . . . . . . . . . . . . . . . . . . . . . . . . . 18
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Analog TV processing. . . . . . . . . . . . . . . . . . . . 1
Digital TV processing . . . . . . . . . . . . . . . . . . . . 2
FM radio mode . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 13
IF input switch. . . . . . . . . . . . . . . . . . . . . . . . . 15
VIF demodulator . . . . . . . . . . . . . . . . . . . . . . . 15
VIF AGC and tuner AGC. . . . . . . . . . . . . . . . . 15
Mode selection of VIF AGC . . . . . . . . . . . . . . 15
VIF AGC monitor . . . . . . . . . . . . . . . . . . . . . . 15
Tuner AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
DIF/SIF FM and AM sound AGC . . . . . . . . . . 16
Frequency phase-locked loop for VIF . . . . . . . 16
DIF/SIF converter stage . . . . . . . . . . . . . . . . . 17
Mono sound demodulator . . . . . . . . . . . . . . . . 17
FM PLL narrowband demodulation. . . . . . . . . 17
AM sound demodulation . . . . . . . . . . . . . . . . . 17
Audio amplifier . . . . . . . . . . . . . . . . . . . . . . . . 17
Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
I
Read format . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Write format . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Subaddress. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Description of data bytes . . . . . . . . . . . . . . . . 24
Analog TV signal processing . . . . . . . . . . . . . 40
Digital TV signal processing . . . . . . . . . . . . . . 78
Introduction to soldering . . . . . . . . . . . . . . . . . 97
Wave and reflow soldering . . . . . . . . . . . . . . . 97
2
C-bus transceiver and slave address . . . . . . 18
16.3
16.4
17
17.1
17.2
17.3
17.4
18
19
20
20.1
20.2
20.3
20.4
21
22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Soldering of through-hole mount packages . 99
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . 100
Revision history . . . . . . . . . . . . . . . . . . . . . . 101
Legal information . . . . . . . . . . . . . . . . . . . . . 102
Contact information . . . . . . . . . . . . . . . . . . . 102
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 97
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 98
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Soldering by dipping or by solder wave . . . . . 99
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 99
Package related soldering information . . . . . 100
Data sheet status . . . . . . . . . . . . . . . . . . . . . 102
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . 102
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . 102
TDA9897; TDA9898
Multistandard hybrid IF processing
Document identifier: TDA9897_TDA9898_4
Date of release: 25 May 2009
All rights reserved.