PCA9674ABS PHILIPS [NXP Semiconductors], PCA9674ABS Datasheet
PCA9674ABS
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PCA9674ABS Summary of contents
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PCA9674/74A Remote 8-bit I/O expander for Fm+ I Rev. 02 — 12 October 2006 1. General description The PCA9674/74A provide general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional bus (I Fast-mode Plus (Fm+) family. The ...
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... I Medical equipment I PLCs I Cellular telephones I Gaming machines I Instrumentation and test measurement 4. Ordering information Table 1. Ordering information Type number Topside mark PCA9674BS 9674 PCA9674ABS 674A PCA9674D PCA9674D PCA9674AD PCA9674AD PCA9674N PCA9674N PCA9674AN PCA9674AN PCA9674PW PCA9674 PCA9674APW PA9674A PCA9674TS PCA9674 PCA9674ATS PCA9674A PCA9674_PCA9674A_2 ...
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NXP Semiconductors 5. Block diagram INT AD0 AD1 AD2 SCL SDA Fig 1. Block diagram of PCA9674/74A data from Shift Register data to Shift Register Fig 2. Simplified schematic diagram PCA9674_PCA9674A_2 Product ...
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... Fig 4. Pin configuration for TSSOP16 INT 1 SCL 2 3 n.c. 4 SDA V 5 PCA9674TS DD PCA9674ATS AD0 6 7 AD1 n.c. 8 AD2 Fig 6. Pin configuration for SSOP20 PCA9674BS PCA9674ABS 12 SCL 11 INT 002aac114 SDA 14 SCL 13 INT ...
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NXP Semiconductors 6.2 Pin description Table 2. Symbol AD0 AD1 AD2 INT SCL SDA V DD Table 3. Symbol INT SCL n.c. SDA V DD AD0 AD1 n.c. AD2 P0 ...
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NXP Semiconductors Table 4. Symbol AD2 [ INT SCL SDA V DD AD0 AD1 [1] HVQFN package die supply ground is connected to both the V pin must be connected ...
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NXP Semiconductors Fig 8. PCA9674/74A address The last bit of the first byte defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation. When AD2, AD1 and ...
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NXP Semiconductors Table 5. AD2 SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL ...
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NXP Semiconductors Table 6. AD2 ...
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NXP Semiconductors Table 6. AD2 SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA [1] The PCA9674A does not acknowledge when AD2, AD1, AD0 follows ...
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NXP Semiconductors Fig 10. Device ID address 7.2.1 Software Reset The Software Reset Call allows all the devices in the I state value through a specific formatted I implies that the I The Software Reset sequence is defined as following: ...
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NXP Semiconductors 7.2.2 Device ID (PCA9674/74A ID field) The Device ID field is a 3-byte read-only (24 bits) word giving the following information: • 8 bits with the manufacturer name, unique per manufacturer (for example, NXP). • 13 bits with ...
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NXP Semiconductors S 1 START condition M7 manufacturer name = 00000000 Fig 13. Device ID field reading 8. I/O programming 8.1 Quasi-bidirectional I/O architecture The PCA9674/74A’s 8 ports (see either as input or output ports. Input data is transferred from ...
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NXP Semiconductors SCL slave address SDA START condition write to port data output from port P5 output voltage P5 pull-up output current INT Fig 14. ...
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NXP Semiconductors 8.4 Power-on reset When power is applied to V PCA9674/74A in a reset condition until V condition is released and the PCA9674/74A registers and I will initialize to their default states. Thereafter V the device. 8.5 Interrupt output ...
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NXP Semiconductors 9. Characteristics of the I 2 The I C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be ...
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NXP Semiconductors SDA SCL MASTER TRANSMITTER/ RECEIVER Fig 19. System configuration 9.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed ...
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NXP Semiconductors 10. Application design-in information 10.1 Bidirectional I/O expander applications In the 8-bit I/O expander application shown in P7 are outputs. When used in this configuration, during a write, the input (P0 and P1) must be written as HIGH ...
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NXP Semiconductors 11. Limiting values Table 7. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot P/out T stg T amb [1] Total package ...
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NXP Semiconductors 12. Static characteristics Table 8. Static characteristics Symbol Parameter Supplies V supply voltage DD I supply current DD I standby current stb V power-on ...
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NXP Semiconductors 13. Dynamic characteristics Table 9. Dynamic characteristics Symbol Parameter f SCL clock frequency SCL t bus free time between a BUF STOP and START ...
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NXP Semiconductors START protocol condition (S) t SU;STA SCL t BUF SDA t HD;STA Rise and fall times refer Fig 23. I C-bus timing diagram PCA9674_PCA9674A_2 Product data sheet Remote 8-bit I/O expander for Fm+ I bit ...
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NXP Semiconductors 14. Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS ...
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NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...
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NXP Semiconductors DIP16: plastic dual in-line package; 16 leads (300 mil); long body pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm ...
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NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...
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NXP Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 1.4 mm 1.5 ...
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NXP Semiconductors 15. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However completely safe you must take normal precautions appropriate to handling integrated circuits. 16. Soldering 16.1 Introduction There is no soldering method ...
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NXP Semiconductors packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 10 Table 10. Package thickness (mm) < 2.5 2.5 Table 11. Package thickness ...
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NXP Semiconductors 16.3.2 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave ...
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NXP Semiconductors Table 12. Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Package Surface mount BGA, HTSSON..T LFBGA, SQFP, SSOP..T VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS [7] ...
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... Product data sheet Remote 8-bit I/O expander for Fm+ I Data sheet status Change notice Product data sheet - information”: Topside mark for PCA9674ABS changed from “9674A” to characteristics”, limits for I , supply current changed from “100 A (typ.); DD Objective data sheet - Rev. 02 — 12 October 2006 ...
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NXP Semiconductors 19. Legal information 19.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...