PCA9922BS NXP [NXP Semiconductors], PCA9922BS Datasheet

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PCA9922BS

Manufacturer Part Number
PCA9922BS
Description
8-channel constant current LED driver with output error detection
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.PCA9922BS.pdf (26 pages)
1. General description
2. Features
The PCA9922 is an 8-channel constant current LED driver designed for LED signage and
display applications. The output current is adjustable from 15 mA to 60 mA controlled by
an external series resistor. The outputs are controlled via a serial interface with a
maximum clock frequency of 25 MHz to allow for the system requirement of high volume
data transmission. Each of the 8 channel outputs has edge rate control to limit the change
in current when the outputs are enabled or disabled.
The device has built-in circuitry for detecting LED open-circuit and output short to ground.
After signaling the specified error detect sequence on the input control lines, error status
can be read out of the device via the serial data out.
The device is designed such that it may be cascaded with other similar devices. The SDO
pin contains the output of the shift register which may be used for cascading to the SDI pin
of the next device in the series. SDO changes state on the falling edge of CLK. SDI
captures data on the rising edge of CLK.
The PCA9922 is a pin-to-pin functionally equivalent 5 V alternative (exception: error data
is inverted; see
STP08CDC596.
The PCA9922 is available in DIP16, TSSOP16 and HVQFN20 packages and is specified
over the 40 C to +85 C industrial temperature range.
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PCA9922
8-channel constant current LED driver with output error
detection
Rev. 01 — 15 January 2009
25 MHz serial interface
3.3 V to 5.5 V operation
8 LED low side constant current outputs
Global control for the 8 LED outputs variable between 15 mA to 60 mA
15 mA to 60 mA maximum current for all 8 output channels set by an external resistor
Constant current matching at 25 C, V
Bit-to-bit: 6 %
Chip-to-chip: 10 %
Gradual turn-on/turn-off output to limit EMI
Error detection mode for line open, output short to ground, LED open and LED short
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
40 C to +85 C operation
Section
7.2.1,
Section 7.2.2
DD
= 5.0 V
and
Section
7.2.7) for the ST2221A and
Product data sheet

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PCA9922BS Summary of contents

Page 1

PCA9922 8-channel constant current LED driver with output error detection Rev. 01 — 15 January 2009 1. General description The PCA9922 is an 8-channel constant current LED driver designed for LED signage and display applications. The output current is adjustable ...

Page 2

... PCA9922BS HVQFN20 plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 4.1 Ordering options Table 2. Type number PCA9922N PCA9922PW PCA9922BS PCA9922_1 Product data sheet 8-channel constant current LED driver with output error detection 5 0.85 mm Ordering options Topside mark Temperature range ...

Page 3

NXP Semiconductors 5. Block diagram Fig 1. PCA9922_1 Product data sheet 8-channel constant current LED driver with output error detection LED0 LED1 V DD R_EXT CURRENT REGULATOR OUTPUT ENABLE LE 8 DATA LATCH V SS SDI 8 ...

Page 4

... PCA9922 SDI CLK 3 LE/DM1 4 PCA9922PW 5 LED0 LED1 6 LED2 7 LED3 8 002aad163 Fig 3. Pin configuration for TSSOP16 15 SDO 14 OE/DM2 PCA9922BS 13 LED7 12 LED6 11 LED5 002aad349 © NXP B.V. 2009. All rights reserved R_EXT 14 SDO 13 OE/DM2 12 LED7 11 LED6 10 LED5 9 LED4 ...

Page 5

NXP Semiconductors 6.2 Pin description Table input output. Symbol V SS SDI CLK LE/DM1 LED0 LED1 LED2 LED3 LED4 LED5 LED6 LED7 OE/DM2 SDO R_EXT V DD n.c. [1] HVQFN20 package die supply ground is ...

Page 6

NXP Semiconductors 7. Functional description The PCA9922 is an 8-channel constant current LED driver with built-in LED output error detection. The PCA9922 contains an 8-bit shift register and data latches, which convert serial input data into parallel output data. At ...

Page 7

NXP Semiconductors Fig 5. 7.2 LED output error detection The PCA9922 has built-in circuitry for detecting LED open-circuit and output short conditions. A predefined set of signal sequence on the input control lines must be initiated to perform the output ...

Page 8

NXP Semiconductors Table 4. State of output port off on [1] I th(det) 7.2.2 Short-circuit detection principle The LED short-circuit detection compares the effective voltage level (V shorted-load detection threshold voltages V V th(det)sc V th(norm error status ...

Page 9

NXP Semiconductors 7.2.4 Setting the outputs to test Before the Capture Fault sequence may be performed, the outputs must be set up. A logic HIGH must be sent to the output control register for all eight bits. This is done ...

Page 10

NXP Semiconductors 7.2.6 Exit error detect mode The ‘Exit error detect mode’ sequence is used to exit the error detect mode of operation and resume normal mode. This is a 5-clock timing sequence using CLK, OE and LE. This sequence ...

Page 11

CLK SDI shift_reg[n-1:0] SDO previous serial data shifting out OE LE fault_load fault_data[n-1:0] error_detect_mode Lower-case signal names are internal signals shown to aid understanding of timing. Fig 9. Timing for a complete error detection sequence at ...

Page 12

NXP Semiconductors 8. Application design-in information MICROCONTROLLER Fig 10. Typical application V DD CPU Fig 11. The PCA9922 in a typical multi-device architecture PCA9922_1 Product data sheet 8-channel constant current LED driver with output error detection LED0 ...

Page 13

NXP Semiconductors 9. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol O(LED) V O(SDO O(LEDn) f clk T stg tot 10. Recommended ...

Page 14

NXP Semiconductors 12. Static characteristics Table 9. Static characteristics unless otherwise specified. DD amb Symbol Parameter V short-circuit detection threshold th(det)sc voltage V normal mode threshold voltage th(norm) Control interface (OE, LE, ...

Page 15

NXP Semiconductors 13. Dynamic characteristics Table 10. Dynamic characteristics Symbol Parameter t LE pulse width w(LE pulse width w(OE) t SDI set-up time su(SDI) t SDI hold time h(SDI) f frequency on pin CLK CLK clock duty cycle ...

Page 16

NXP Semiconductors [2] OE must be held active LOW for at least the duration of the rise/fall time of the LEDn pins. This pulse width does not apply to active LOW times for executing error detect sequences. [3] Timing required ...

Page 17

NXP Semiconductors Fig 14. Timing 2 PCA9922_1 Product data sheet 8-channel constant current LED driver with output error detection t w(OE PD(OE-LEDH) t PD(OE-LEDL) LEDn w(LE PD(LEH-LEDH) t PD(LEH-LEDL) ...

Page 18

NXP Semiconductors 14. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...

Page 19

NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...

Page 20

NXP Semiconductors HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 0.85 mm terminal 1 index area terminal 1 20 index area DIMENSIONS (mm are ...

Page 21

NXP Semiconductors 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages ...

Page 22

NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities ...

Page 23

NXP Semiconductors Fig 18. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 17. Soldering of through-hole mount packages 17.1 Introduction to soldering through-hole mount ...

Page 24

NXP Semiconductors 17.4 Package related soldering information Table 13. Package CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL [2] PMFP [1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] For ...

Page 25

NXP Semiconductors 20. Legal information 20.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

Page 26

NXP Semiconductors 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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