ADSP-2109 AD [Analog Devices], ADSP-2109 Datasheet - Page 12

• Manufacturer Part Number: ADSP-2109
• Description: Low Cost DSP Microcomputers
• Manufacturer: AD [Analog Devices]

ADSP-2104/ADSP-2109–SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
Parameter
V
T
See “Environmental Conditions” for information on thermal specifications.
ELECTRICAL CHARACTERISTICS
Parameter
V
V
V
V
V
I
I
I
I
C
C
NOTES
10
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.3 V to V
Output Voltage Swing . . . . . . . . . . . . . . –0.3 V to V
Operating Temperature Range (Ambient) . . . –55ºC to +125 C
Storage Temperature Range . . . . . . . . . . . . . –65 C to +125 C
Lead Temperature (10 sec) PGA . . . . . . . . . . . . . . . . . +300 C
Lead Temperature (5 sec) PLCC, PQFP, TQFP . . . . +280 C
*Stresses greater than those listed above may cause permanent damage to the
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADSP-2104/ADSP-2109 processor features proprietary ESD protection circuitry to dissipate
high energy electrostatic discharges (Human Body Model), permanent damage may occur to devices
subjected to such discharges. Therefore, proper ESD precautions are recommended to avoid
performance degradation or loss of functionality. Unused devices must be stored in conductive foam
or shunts, and the foam should be discharged to the destination socket before the devices are
removed. Per method 3015 of MIL-STD-883, the ADSP-2104/ADSP-2109 processor has been
classified as Class 1 device.
1
2
3
4
5
6
7
8
9
IH
IL
OZH
OZL
device. These are stress ratings only, and functional operation of the device at these
or any other conditions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Input-only pins: CLKIN, RESET, IRQ2, BR, MMAP, DR1, DR0.
Output pins: BG, PMS, DMS, BMS, RD, WR, A0–A13, CLKOUT, DT1, DT0.
Bidirectional pins: D0–D23, SCLK1, RFS1, TFS1, SCLK0, RFS0, TFS0.
Three-state pins: A0–A13, D0–D23, PMS, DMS, BMS, RD, WR, DT1, SCLK1, RSF1, TFS1, DT0, SCLK0, RFS0, TFS0.
Input-only pins: RESET, IRQ2, BR, MMAP, DR1, DR0.
0 V on BR, CLKIN Active (to force three-state condition).
Although specified for TTL outputs, all ADSP-2104/ADSP-2109 outputs are CMOS-compatible and will drive to V
Guaranteed but not tested.
Applies to PGA, PLCC, PQFP package types.
Output pin capacitance is the capacitive load for any three-stated output pin.
DD
IH
IH
IL
OH
OL
AMB
I
O
Hi-Level Input Voltage
Hi-Level CLKIN Voltage
Lo-Level Input Voltage
Hi-Level Output Voltage
Lo-Level Output Voltage
Hi-Level Input Current
Lo-Level Input Current
Three-State Leakage Current
Three-State Leakage Current
Input Pin Capacitance
Output Pin Capacitance
Supply Voltage
Ambient Operating Temperature
1, 8, 9
3, 5
1, 3
1
1
4, 8, 9, 10
2, 3, 7
2, 3, 7
4
4
*
Test Conditions
@ V
@ V
@ V
@ V
@ V
@ V
@ V
@ V
@ V
@ V
@ V
@ V
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
IN
IN
= 2.5 V, f
= 2.5 V, f
= max
= max
= min
= min, I
= min, I
= min, I
= max, V
= max, V
= max, V
= max, V
DD
DD
+ 0.3 V
+ 0.3 V
OH
OH
OL
IN
IN
IN
IN
IN
IN
= 2 mA
= –0.5 mA
= –100 A
= 1.0 MHz, T
= 1.0 MHz, T
= V
= 0 V
= V
= 0 V
–12–
DD
DD
6
max
max
8
6
AMB
AMB
= 25 C
= 25 C
Min
4.50
0
DD
K Grade
Min
2.0
2.2
2.4
V
and GND, assuming no dc loads.
DD
– 0.3
WARNING!
Max
5.50
+70
Max
0.8
0.4
10
10
10
10
8
8
ESD SENSITIVE DEVICE
REV. 0
Unit
Unit
V
V
V
V
V
V
pF
pF
V
A
A
A
A
C