MPC8270 MOTOROLA [Motorola, Inc], MPC8270 Datasheet - Page 58

• Manufacturer Part Number: MPC8270
• Description: PowerQUICC II Family Hardware Specifications
• Manufacturer: MOTOROLA [Motorola, Inc]

Table 22 shows the pinout list of the MPC8275 and MPC8270. Table 21 defines conventions and acronyms
used in Table 22.
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
58
MPC8275/MPC8270
In the VR package, sphere composition is lead-free (refer to Table 2). This
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Users should consult “Motorola PowerQUICC II™
Pb-Free Packaging Information” (MPC8250PBFREEPKG) available at
www.motorola.com/semiconductors.
Table 22. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List
MPC8280 PowerQUICC II™ Family Hardware Specifications
NOTE: Temperature Reflow for the VR Package
Pin Name
MPC8275 only
Ball
C16
F11
E11
D2
C1
D1
D5
E8
C4
B4
A4
D7
D8
C6
B5
B6
C7
C8
A6
D9
B7
B8
C9
A7
B9
A8
MOTOROLA