MPC8270 MOTOROLA [Motorola, Inc], MPC8270 Datasheet - Page 72

• Manufacturer Part Number: MPC8270
• Description: PowerQUICC II Family Hardware Specifications
• Manufacturer: MOTOROLA [Motorola, Inc]

9.2
Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA (ZU)
package. Refer to Table 2.
Figure 18 provides the mechanical dimensions and bottom surface nomenclature of the 516 PBGA (VR/ZQ)
packages.
72
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA
Mechanical Dimensions
MPC8280 PowerQUICC II™ Family Hardware Specifications
Notes:
1. Dimensions and Tolerancing per
2. Dimensions in millimeters.
3. Dimension b is measured at the
4. Primary data A and the seating
ASME Y14.5M-1994.
maximum solder ball diameter,
parallel to primary data A.
plane are defined by the spherical
crowns of the solder balls.
Dim
A1
A2
A3
D1
E1
A
D
E
b
e
1.45
0.60
0.85
0.25
0.65
Min
Millimeters
37.50 BSC
37.50 BSC
35.56 REF
35.56 REF
1.27 BSC
MOTOROLA
Max
1.65
0.70
0.95
0.85
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