MPC8347 FREESCALE [Freescale Semiconductor, Inc], MPC8347 Datasheet - Page 61
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MPC8347
Manufacturer Part Number
MPC8347
Description
Integrated Host Processor Hardware Specifications
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
1.MPC8347.pdf
(108 pages)
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18.3
Freescale Semiconductor
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm,
620 Plastic ball grid array (PBGA).
Package outline
Interconnects
Pitch
Module height (maximum)
Module height (typical)
Module height (minimum)
Solder Balls
Ball diameter (typical)
Package Parameters for the MPC8347EA PBGA
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3
620
1.00 mm
2.46 mm
2.23 mm
2.00 mm
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
0.60 mm
29 mm × 29 mm
Package and Pin Listings
61