UJA1078 NXP [NXP Semiconductors], UJA1078 Datasheet - Page 31

• Manufacturer Part Number: UJA1078
• Description: High-speed CAN/dual LIN core system basis chip
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
UJA1078_2
Product data sheet
Table 9.
[1]
[2]
Symbol
R
Fig 14. HTSSOP32 thermal resistance junction to ambient as a function of PCB copper
th(j-a)
According to JEDEC JESD51-2 and JESD51-3 at natural convection on 1s board.
According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with
two inner copper layers (thickness: 35 μm) and thermal via array under the exposed pad connected to the
first inner copper layer.
R
(K/W)
th(j-a)
90
70
50
30
area
Parameter
thermal resistance from junction to
ambient
Thermal characteristics
0
with heatsink top layer
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
2
without heatsink top layer
High-speed CAN/dual LIN core system basis chip
4
Conditions
single-layer board
four-layer board
6
PCB Cu heatsink area (cm
8
UJA1078
015aaa138
© NXP B.V. 2010. All rights reserved.
2
[1]
[2]
)
Typ
78
39
10
Unit
K/W
K/W
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