P82B96TD/S900 NXP [NXP Semiconductors], P82B96TD/S900 Datasheet - Page 29

• Manufacturer Part Number: P82B96TD/S900
• Description: Dual bidirectional bus buffer
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
14. Abbreviations
P82B96_8
Product data sheet
13.4 Package related soldering information
Table 9.
[1]
[2]
Table 10.
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
Acronym
CDM
DDC
ESD
HBM
IC
I
MM
SMBus
2
C-bus
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Abbreviations
Description
Charged Device Model
Display Data Channel
ElectroStatic Discharge
Human Body Model
Integrated Circuit
Inter IC bus
Machine Model
System Management Bus
Rev. 08 — 10 November 2009
Soldering method
Dipping
-
suitable
-
Dual bidirectional bus buffer
Wave
suitable
suitable
not suitable
© NXP B.V. 2009. All rights reserved.
P82B96
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