PX1011A-ELG NXP [NXP Semiconductors], PX1011A-ELG Datasheet - Page 19
![no-image](/images/no-image-200.jpg)
PX1011A-ELG
Manufacturer Part Number
PX1011A-ELG
Description
PCI Express stand-alone X1 PHY
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.PX1011A-ELG.pdf
(32 pages)
Philips Semiconductors
9. Limiting values
10. Thermal characteristics
PX1011A_PX1012A_2
Product data sheet
Table 16.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
Table 17.
[1]
Symbol
V
V
V
V
V
V
V
T
T
T
Symbol
R
R
stg
j
amb
DDD1
DDD2
DDD3
DD
DDA1
DDA2
esd
th(j-a)
th(j-c)
Human Body Model: ANSI/EOS/ESD-S5.1-1994, standard for ESD sensitivity testing, Human Body Model -
Component level; Electrostatic Discharge Association, Rome, NY, USA.
Charged Device Model: ANSI/EOS/ESD-S5.3.1-1999, standard for ESD sensitivity testing, Charged Device
Model - component level; Electrostatic Discharge Association, Rome, NY, USA.
Significant variations can be expected due to system variables, such as adjacent devices, or actual air flow
across the package.
Parameter
digital supply voltage 1
digital supply voltage 2
digital supply voltage 3
supply voltage
analog supply voltage 1
analog supply voltage 2
electrostatic discharge voltage
storage temperature
junction temperature
ambient temperature
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to case
Limiting values
Thermal characteristics
Rev. 02 — 18 May 2006
Conditions
for JTAG I/O
for SSTL_2 I/O
for core
for high-speed
serial I/O and PVT
for serializer
for serializer
HBM
CDM
operating
commercial
industrial
PX1011A/PX1012A
Conditions
in free air
in free air
PCI Express stand-alone X1 PHY
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
[1]
[2]
Min
-
-
0
0.5
0.5
0.5
0.5
0.5
0.5
55
55
40
[1]
[1]
Typ
44
10
Max
+4.6
+3.75
+1.7
+1.7
+1.7
+4.6
2000
500
+150
+125
+70
+85
Unit
K/W
K/W
19 of 32
Unit
V
V
V
V
V
V
V
V
C
C
C
C