TEA152X PHILIPS [NXP Semiconductors], TEA152X Datasheet - Page 14

• Manufacturer Part Number: TEA152X
• Description: SMPS ICs for low-power systems
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
Fig 8.
TEA152X_3
Product data sheet
SO14: plastic small outline package; 14 leads; body width 3.9 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
inches
UNIT
mm
Package outline SOT108-1 (SO14)
OUTLINE
VERSION
SOT108-1
0.069
max.
1.75
A
0.010
0.004
0.25
0.10
A
14
1
1
Z
pin 1 index
y
0.057
0.049
1.45
1.25
A
2
076E06
IEC
0.01
0.25
e
A
3
0.019
0.014
0.49
0.36
b
p
D
0.0100
0.0075
0.25
0.19
MS-012
JEDEC
c
REFERENCES
8.75
8.55
0.35
0.34
D
(1)
Rev. 03 — 23 March 2009
0
0.16
0.15
E
4.0
3.8
b
(1)
p
8
7
JEITA
scale
1.27
0.05
2.5
e
w
M
c
0.244
0.228
H
6.2
5.8
E
A
2
0.041
5 mm
1.05
A
L
1
0.039
0.016
1.0
0.4
L
p
H
E
E
detail X
0.028
0.024
SMPS ICs for low-power systems
0.7
0.6
Q
L
PROJECTION
L
EUROPEAN
0.25
0.01
p
Q
v
(A )
3
0.25
0.01
A
w
0.004
A
TEA152x
0.1
© NXP B.V. 2009. All rights reserved.
v
X
y
M
ISSUE DATE
99-12-27
03-02-19
A
0.028
0.012
Z
0.7
0.3
(1)
SOT108-1
8
0
o
o
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