SA5211D PHILIPS [NXP Semiconductors], SA5211D Datasheet - Page 15
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SA5211D
Manufacturer Part Number
SA5211D
Description
Transimpedance amplifier 180MHz
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
1.SA5211D.pdf
(20 pages)
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APPLICATION INFORMATION
Package parasitics, particularly ground lead inductances and
parasitic capacitances, can significantly degrade the frequency
response. Since the SA5211 has differential outputs which can feed
back signals to the input by parasitic package or board layout
capacitances, both peaking and attenuating type frequency
response shaping is possible. Constructing the board layout so that
Ground 1 and Ground 2 have very low impedance paths has
produced the best results. This was accomplished by adding a
ground-plane stripe underneath the device connecting Ground 1,
1998 Oct 07
Transimpedance amplifier (180MHz)
I
IN
V
IN
Figure 13. Shunt-Series Input Stage
INPUT
I
F
I
B
PHOTODIODE
R1
Q1
R
F
I
C1
INPUT
Q2
R2
GND
Figure 12. Transimpedance Amplifier
Q
Q3
1
R
SD00329
1
R3
V
R4
1
R
EQ3
5
Q
V
2
R
CC
2
Q
3
R
R
3
4
Q
4
+
R
V
7
15
CC1
Q
15
R
R
Pins 8–11, and Ground 2, Pins 1 and 2 on opposite ends of the
SO14 package. This ground-plane stripe also provides isolation
between the output return currents flowing to either V
2 and the input photodiode currents to flowing to Ground 1. Without
this ground-plane stripe and with large lead inductances on the
board, the part may be unstable and oscillate near 800MHz. The
easiest way to realize that the part is not functioning normally is to
measure the DC voltages at the outputs. If they are not close to their
quiescent values of 3.3V (for a 5V supply), then the circuit may be
oscillating. Input pin layout necessitates that the photodiode be
physically very close to the input and Ground 1. Connecting Pins 3
and 5 to Ground 1 will tend to shield the input but it will also tend to
increase the capacitance on the input and slightly reduce the
bandwidth.
As with any high-frequency device, some precautions must be
observed in order to enjoy reliable performance. The first of these is
the use of a well-regulated power supply. The supply must be
capable of providing varying amounts of current without significantly
changing the voltage level. Proper supply bypassing requires that a
good quality 0.1 F high-frequency capacitor be inserted between
V
pins as possible. Also, the parallel combination of 0.1 F capacitors
with 10 F tantalum capacitors from each supply, V
the ground plane should provide adequate decoupling. Some
applications may require an RF choke in series with the power
supply line. Separate analog and digital ground leads must be
maintained and printed circuit board ground plane should be
employed whenever possible.
Figure 14 depicts a 50Mb/s TTL fiber-optic receiver using the
BPF31, 850nm LED, the SA5211 and the SA5214 post amplifier.
12
14
CC1
and V
GND
R
15
Q
2
CC2
VB2
16
, preferably a chip capacitor, as close to the package
R
13
+
Q
11
Q
12
SD00328
V
OUT–
OUT+
CC2
Product specification
CC1
SA5211
CC2
and V
or Ground
CC2
, to