STM8L151G4Y3 STMICROELECTRONICS [STMicroelectronics], STM8L151G4Y3 Datasheet - Page 109

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STM8L151G4Y3

Manufacturer Part Number
STM8L151G4Y3
Description
8-bit ultralow power MCU, up to 32 KB Flash, 1 KB Data EEPROM RTC, LCD, timers, USART, I2C, SPI, ADC, DAC, comparators
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
STM8L151xx, STM8L152xx
9.4
Thermal characteristics
The maximum chip junction temperature (T
Table 17: General operating conditions on page
The maximum chip-junction temperature, T
the following equation:
Where:
Table 59.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol
T
Θ
P
P
internal power.
P
Where:
P
taking into account the actual V
the application.
Amax
JA
Θ
Θ
Θ
Θ
Θ
Θ
Dmax
INTmax
I/Omax
I/Omax
JA
JA
JA
JA
JA
JA
is the package junction-to-ambient thermal resistance in ° C/W
is the maximum ambient temperature in ° C
is the sum of P
= Σ (V
represents the maximum power dissipation on output pins
Thermal characteristics
is the product of I
Thermal resistance junction-ambient
UFQFPN28 - 4 x 4 mm
Thermal resistance junction-ambient
WLCSP28
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
Thermal resistance junction-ambient
UFQFPN 32 - 5 x 5 mm
Thermal resistance junction-ambient
LQFP 48- 7 x 7 mm
Thermal resistance junction-ambient
UFQFPN 48- 7 x 7mm
OL
*I
OL
) + Σ((V
INTmax
Doc ID 15962 Rev 5
DD
T
Jmax
DD
and P
and V
Parameter
-V
OL
= T
OH
(1)
/I
I/Omax
DD
OL
Amax
)*I
, expressed in Watts. This is the maximum chip
and V
Jmax
Jmax
OH
+ (P
(P
),
, in degree Celsius, may be calculated using
) must never exceed the values given in
63.
Dmax
OH
Dmax
/I
OH
= P
x Θ
of the I/Os at low and high level in
INTmax
JA
)
+ P
I/Omax
Electrical parameters
Value
118
70
59
38
65
32
)
°C/W
°C/W
°C/W
°C/W
°C/W
109/122
°C/W
Unit

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