STM8L151K6U3 STMICROELECTRONICS [STMicroelectronics], STM8L151K6U3 Datasheet - Page 95

• Manufacturer Part Number: STM8L151K6U3
• Description: 8-bit ultralow power MCU, up to 32 KB Flash, 1 KB Data EEPROM RTC, LCD, timers, USART, I2C, SPI, ADC, DAC, comparators
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STM8L151xx, STM8L152xx
Table 54.
1. Thickness valid for the WFQFPN32 package in the sampling phase. In the production phase, the UFQFPN32 package will
2. Values in inches are converted from mm and rounded to 4 decimal digits.
be used with a thickness equal to 0.6 mm.
Dim.
A
ddd
D2
A1
A3
E2
D
E
N
b
e
L
(1)
Figure 23. WFQFPN32 – 32-lead very very thin fine pitch quad flat no-lead package
1. The exposed pad must be soldered to the PCB. It is recommended to connect it to V
WFQFPN32 – 32-lead very very thin fine pitch quad flat no-lead package (5 x 5),
package mechanical data
0.70
0.18
4.85
3.20
4.85
3.20
0.30
Min
0
outline (5 x 5)
Seating plane
Pin # 1 ID
R = 0.30
0.75
0.02
0.20
0.25
5.00
3.45
5.00
3.45
0.50
0.40
0.08
mm
Typ
C
E2
A3
b
(1)
8
1
Doc ID 15962 Rev 2
32
9
e
Max
0.80
0.05
0.30
5.15
3.70
5.15
3.70
0.50
Bottom view
Number of pins
D2
D
32
16
0.0276
0.0071
0.1909
0.1260
0.1909
0.1260
0.0118
L
Min
17
24
L
A1
E
A
inches
0.0295
0.0008
0.0079
0.0098
0.1969
0.1358
0.1969
0.1358
0.0197
0.0157
0.0031
Package characteristics
ddd C
Typ
A0A3_ME
(2)
SS
.
0.0315
0.0020
0.0118
0.2028
0.1457
0.2028
0.1457
0.0197
Max
95/101