STM8L151K6U3 STMICROELECTRONICS [STMicroelectronics], STM8L151K6U3 Datasheet - Page 97

• Manufacturer Part Number: STM8L151K6U3
• Description: 8-bit ultralow power MCU, up to 32 KB Flash, 1 KB Data EEPROM RTC, LCD, timers, USART, I2C, SPI, ADC, DAC, comparators
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STM8L151xx, STM8L152xx
Table 56.
1. Thickness valid for the VFQFPN48 package in the sampling phase. In the production phase, the UFQFPN48 package will
2. Values in inches are converted from mm and rounded to 4 decimal digits.
1. Drawing is not to scale.
2. The exposed pad must be soldered to the PCB. It is recommended to connect it to V
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
Figure 25. VFQFPN48 7 x 7 mm, 0.5 mm pitch, package
(1)
Symbol
be used with a thickness equal to 0.6 mm.
VFQFPN48 – very thin fine pitch quad flat pack no-lead 7 × 7 mm, 0.5 mm
pitch package mechanical data
E
outline
A
A2
e
L
L
A1
0.900
0.020
0.650
0.250
0.230
7.000
4.700
7.000
4.700
0.500
0.400
12
Typ
1
(1)(2)
13
48
D2
D
millimeters
b
e
0.800
0.180
6.850
2.250
6.850
2.250
0.450
0.300
0.080
Min
37
24
25
36
A3
Doc ID 15962 Rev 2
Seating
plane
b
C
(1)
E2
1.000
0.050
1.000
0.300
7.150
5.250
7.150
5.250
0.550
0.500
Max
V0_ME
Figure 26. Recommended footprint
0.0354
0.0008
0.0256
0.0098
0.0091
0.2756
0.1850
0.2756
0.1850
0.0197
0.0157
Typ
7.30
0.30
0.55
0.20
SS
12
1
.
48
13
(dimensions in mm)
inches
6.20
0.0315
0.0071
0.2697
0.0886
0.2697
0.0886
0.0177
0.0118
0.0031
Package characteristics
Min
7.30
5.60
5.80
6.20
(2)
5.60
0.50
37
24
0.0394
0.0020
0.0394
0.0118
0.2815
0.2067
0.2815
0.2067
0.0217
0.0197
36
25
Max
0.75
(1)
5.80
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